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中科芯 微系统集成工艺中心主任 王成迁确认演讲 | 2025势银(第五届)光刻产业大会(PRIC 2025)
势银芯链· 2025-06-20 05:22
Core Viewpoint - The 2025 TrendBank Lithography Industry Conference aims to address the challenges and opportunities in the lithography technology sector, particularly in the context of AI advancements and the need for domestic self-sufficiency in semiconductor manufacturing [11][19]. Group 1: Conference Overview - The conference will take place on July 9-10, 2025, at the Sheraton Hotel in Hefei, Anhui, with an expected attendance of 300 participants [11][20]. - The agenda includes discussions on cutting-edge lithography technologies such as EUV, electron beam lithography, and nanoimprint, as well as the current state and technological bottlenecks of lithography materials like photoresists and wet electronic chemicals [11][12]. Group 2: Keynote Speakers and Topics - Wang Chengqian, Director of the Micro System Integration Process Center at Zhongke Xinxin Integrated Circuit Co., will present on "High-Performance Chip Heterogeneous Integration Technology: Opportunities and Challenges" [4][8]. - Other notable speakers include experts from BOE Technology Group and Nankai University, discussing various aspects of lithography technology and materials [8][9]. Group 3: Industry Challenges - The domestic production rate of high-end photoresists is low, and there is a significant gap in R&D and production technology compared to international standards, affecting the quality required for advanced chip manufacturing [18][19]. - The lithography equipment market is dominated by foreign companies, with high-end lithography machines like EUV being particularly difficult to obtain, posing a significant challenge to the domestic semiconductor industry [18][19]. Group 4: Conference Goals - The conference aims to foster collaboration among experts, industry representatives, and academic institutions to enhance the integration of research and application in lithography technology [19]. - It seeks to build a comprehensive ecosystem for the lithography industry, promoting resource integration and competitive advantages [19].
【展商推荐】硅芯科技:涵盖堆叠芯片设计所需环节的全流程工具 | 2025异质异构集成封装大会(HIPC 2025)
势银芯链· 2025-04-23 04:10
"宁波膜智信息科技有限公司"为势银(TrendBank)唯一工商注册实体及收款账户 势银研究: 势银产业研究服务 势银数据: 势银数据产品服务 势银咨询: 势银咨询顾问服务 重要会议: 4月29日,2025势银异质异构集成封装产业大会(浙江宁波) 点此报名 添加文末微信,加 先进封装 群 珠海硅芯科技有限公司 诚邀您莅临于2025年4月29日在浙江 · 宁波 ( 甬江实验室) 举办的 2025势银异质异构集成封装产业大会 公司介绍 珠海硅芯科技有限公司主要从事新一代2.5D/3D堆叠芯片EDA软件设计的研发及产业化。创始人团队从2008年开始研究2.5D/3D芯片设计方法,是世界最 早期研究设计方法的研究团队之一,并在堆叠芯片EDA后端布局、布线、可测试、可靠性等方面均有世界领先成果。 公司自主研发3Sheng Integration Platform,分为系统级架构设计、物理实现、Multi-die测试容错、分析仿真、多Chiplet集成验证五大中心,涵盖堆叠 芯片设计所需环节的全流程工具。目前,硅芯科技系列产品已通过先进封装产业验证,完成设计制造闭环,并打造首批客户案例,全方位助力 AI,GPU,CPU, ...
长川科技 董事、副总经理 钟锋浩确认演讲 | 2025异质异构集成封装大会(HIPC 2025)
势银芯链· 2025-04-21 08:15
"宁波膜智信息科技有限公司"为势银(TrendBank)唯一工商注册实体及收款账户 势银研究: 势银产业研究服务 势银数据: 势银数据产品服务 势银咨询: 势银咨询顾问服务 重要会议: 4月29日,2025势银异质异构集成封装产业大会(浙江宁波) 点此报名 添加文末微信,加 先进封装 群 长川科技 董事、副总经理 钟锋浩 已 确认参 加 2025势银异质异构集成封装产业大会 ,并作为嘉宾进行主题为 《 Chiplet异构集成对测试技术 的挑战 》 的演讲。 钟锋浩, 长川科技董事、副总经理,高级工程师,专注集成电路测试装备研究开发近30 年,是集成电路测试装备领域一流资深技术专家,Chiplet测试标准编写组组长,全国集 成电路标准化技术委员会TC599专家成员。目前已申请集成电路测试技术相关专利79 项。 杭州长川科技股份有限公司 成立于2008年4月,是一家专注于集成电路封测装备研发、 生产和销售的高新技术企业,主要产品包括集成电路测试机、分选机、探针台、AOI设备 和自动化检测装备,客户包含了日月光、台积电、华天科技、长电科技、通富微电、矽 力杰等国内外一流集成电路企业。通过17年的技术积累和研发创新, ...