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一次集齐四大芯片巨头CEO,联想成了“最大公约数”
Di Yi Cai Jing· 2026-01-07 06:48
Core Insights - The gathering of the four major chip giants—NVIDIA, Intel, AMD, and Qualcomm—at the Lenovo Tech World during CES 2026 highlights the evolving dynamics of the semiconductor industry, where collaboration and competition coexist in the AI narrative [1] - The focus is shifting from individual chip manufacturers to system-level players that can integrate diverse computing power and facilitate the deployment of intelligent hardware solutions [1] Group 1: Industry Transformation - Jensen Huang, CEO of NVIDIA, emphasized the significance of AI as a foundational architecture akin to operating systems, marking a new platform shift in computing [4] - The IT industry has invested approximately $10 to $15 trillion over the past thirty years, necessitating a complete overhaul to adapt to AI applications [5] - Huang and Lenovo's CEO, Yang Yuanqing, announced a new collaboration plan to create a "Lenovo AI Cloud Super Factory," aiming to standardize AI infrastructure and transition from highly customized deployments to industrialized solutions [5][7] Group 2: Competitive Landscape - AMD's CEO, Lisa Su, introduced the Helios rack-level AI platform, positioning it as a direct challenge to NVIDIA's GPU-centric approach, highlighting the need for robust system-level infrastructure to support larger models and higher throughput [8] - Intel's new CEO, Pat Gelsinger, showcased the Aura Edition AI PC, which integrates the latest Intel processors, indicating a shift from traditional PCs to data centers and cloud computing [9][10] - Qualcomm's focus on AI-native endpoints, particularly in wearable devices, reflects a broader trend towards personal intelligent companions that require low power consumption and continuous connectivity [10] Group 3: Collaborative Ecosystem - The collaboration among the four chip giants illustrates a new industry consensus that the true value of AI lies not in possessing the most powerful chip but in transforming computing power into usable capabilities for enterprises and users [11] - Lenovo's role as a "system integrator" and "scene amplifier" is crucial in this collaborative ecosystem, as it bridges the various offerings from NVIDIA, AMD, Intel, and Qualcomm [11] - The wearable device market is projected to exceed one billion units, showcasing the potential for growth in AI-driven consumer technology [11]
英特尔CEO陈立武:AI正在重塑软硬件市场格局
Xin Lang Cai Jing· 2026-01-07 02:57
新浪科技讯 1月7日上午消息,在2026年国际消费电子展(CES 2026)期间,联想创新科技大会举行, 英特尔CEO陈立武表示,AI正在重塑整个软硬件市场的格局,通过不断迭代,提升用户的日常生活体 验。英特尔与联想一直致力于打造极致AI PC体验。 本次CES,英特尔与联想一起发布了共同开发的Aura Edition AI PC和FIFA联名款游戏电脑拯救者Legion Pro 7i。陈立武表示,Aura Edition产品组合将全线搭载英特尔首款采用自家18A制程的芯片酷睿Ultra 300系列处理器。"未来,双方在PC、数据中心和云计算领域将继续深化合作。" 新浪声明:所有会议实录均为现场速记整理,未经演讲者审阅,新浪网登载此文出于传递更多信息之目 的,并不意味着赞同其观点或证实其描述。 责任编辑:王翔 专题:联想创新科技大会 新浪科技讯 1月7日上午消息,在2026年国际消费电子展(CES 2026)期间,联想创新科技大会举行, 英特尔CEO陈立武表示,AI正在重塑整个软硬件市场的格局,通过不断迭代,提升用户的日常生活体 验。英特尔与联想一直致力于打造极致AI PC体验。 本次CES,英特尔与联想一起 ...