Core Viewpoint - Semiconductor manufacturing companies, specifically SMIC, are advancing their technology by applying for a new patent related to mask layout design and preparation methods, which aims to reduce process complexity and production costs [1][2]. Group 1: Patent Application - SMIC has applied for a patent titled "Mask Layout Design and Mask Preparation Method, and Semiconductor Structure Formation Method," with publication number CN120386136A, filed on January 2024 [1]. - The patent describes a method that includes generating a first transparent layout and a second transparent layout, which helps in reducing the complexity of the manufacturing process [1]. Group 2: Company Overview - SMIC (Beijing) was established in 2002, focusing on the manufacturing of computers, communications, and other electronic devices, with a registered capital of 100 million USD [2]. - SMIC (Shanghai) was founded in 2000, also in the same industry, with a registered capital of 244 million USD [2]. - Both companies have significant engagement in the market, with SMIC (Beijing) participating in 52 bidding projects and SMIC (Shanghai) in 127 projects, alongside holding 5000 patent records each [2].