Core Viewpoint - The article discusses the upcoming 2025 Heterogeneous Integration Annual Conference, focusing on the theme of "Focusing on the Frontier of Heterogeneous Integration Technology, Advancing the Journey of Advanced Packaging" to promote the development of the advanced electronic information industry in Ningbo and the Yangtze River Delta region [18][20]. Group 1: Conference Details - The conference will take place from November 17-19, 2025, at the Nanyuan Wanghai Hotel in Zhenhai District, Ningbo [22]. - The event is organized by the Yongjiang Laboratory and TrendBank, with support from the Ningbo Electronic Industry Association [22]. - The expected attendance is between 300 to 500 participants [22]. Group 2: Key Themes and Topics - The conference will cover core technologies related to multi-material heterogeneous integration and optoelectronic fusion, focusing on advanced packaging technologies such as 2.5D/3D heterogeneous integration, optical-electrical co-packaging, and wafer-level bonding [20]. - Notable topics include the challenges and trends in heterogeneous integration processes, materials equipment, and the development of advanced packaging solutions [14][20]. Group 3: Featured Speakers and Presentations - Dr. Dustin Ho, Technical Project Director at Applied Materials, will present on "The Application of New Optical Waveguide Technology in Silicon Photonics/CPO" [2]. - Various industry experts will discuss topics such as AI-driven opportunities in chip integration, micro-nano device applications, and the latest advancements in optical technology [14][15][16]. Group 4: Background and Industry Context - The conference aims to address the stringent requirements for chip design and manufacturing driven by applications in artificial intelligence, smart driving, and high-performance computing [18]. - As traditional Moore's Law approaches its physical limits, heterogeneous integration is identified as a crucial and promising direction in the semiconductor field [19].