"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 重要会议： 11 月 17-19 日，2025势银异质异构集成年会（浙江·宁波） 点此报名 添加文末微信，加 异质异构集成产业 群 武汉光迅科技副总经理 马卫东已确认出席本次异质异构集成年会 ，并将做主题为 " 用于CPO的光芯片发展趋势及挑战 " 的相关 报 告。 武汉光迅科技股份有限公司 ：是光电器件、模块研发及产业化全球先行者；专注于光通信 领域近 50年，多项"第一"由此诞生，是"国家认定企业技术中心""国家技术创新示范企 业""光纤通信技术和网络国家重点实验室"，具备光电子芯片、器件、模块及子系统产品的 战略研发和规模量产能力。 光迅科技源于1976年成立的邮电部固体器件研究所，2001年 改制，2009年登陆深圳证券交易所，成为国内首家上市的通信光电子器件公司，连续十八 年入选"中国光器件与辅助设备及原材料最具竞争力企业10强（榜首）""全球光器件最具 竞争力企业10强"。 马卫东 ：教授级高工，现任武汉光迅科技股份有限公司副总经理，从事通信用光子集成芯 片研究开发，多年联合中科院半导体研究所、南京大学，致力于解决 ...

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 重要会议： 11 月 17-19 日，2025势银异质异构集成年会（浙江·宁波） 点此报名 添加文末微信，加 异质异构集成产业 群 应用材料公司 技术项目总监 Dustin Ho 博士确认参与2025 异质异构集成年会 ，并将做主题为 "新型光波导技术在硅光/CPO中的应用" 的主题报 告。 应用材料公司 ：是材料工程解决方案的领导者，全球几乎每一个新生产的芯片和先进显示 器的背后都有应用材料公司的身影。凭借在规模生产的条件下可以在原子级层面改变材料 的技术，我们助力客户实现可能。我们的创新实现更美好的未来。 应用材料公司在中国有着多年坚实的发展历史。 1984年应用材料公司在北京设立了中国客 户服务支持中心，成为第一家进入中国的国际 半导体 设备公司。经过近 40年的发展，应 用材料公司在中国已经成为半导体和显示器生产设备与服务领域的顶级供应商之一。 Dustin Ho博士 ： 应用材料公司ICAPS的技术项目总监，负责实施半导体制程的创新解决 方案。 在2011年至2014年期间，他曾担任一家大型天然气公司的营销总监和国际 ...

Core Viewpoint - The article discusses the upcoming 2025 Heterogeneous Integration Annual Conference organized by TrendBank and the Yongjiang Laboratory, focusing on the strategic opportunities in the new generation of chip development and the importance of heterogeneous integration technology in the semiconductor industry [7][8]. Event Details - The conference will take place from November 17-19, 2025, at the Nanyuan Wanghai Hotel in Zhenhai District, Ningbo [8]. - The event aims to gather industry and research experts to discuss advanced packaging technologies and promote collaboration between the semiconductor industry and research institutions [9]. Conference Agenda - The agenda includes various sessions on topics such as CIS heterogeneous integration processes, 2.5D/3D chip integration, and the impact of artificial intelligence on chip interconnects [3][4]. - Keynote speeches will be delivered by government leaders and representatives from the organizing bodies [3]. Focus Areas - The conference will emphasize multi-material heterogeneous integration, optoelectronic integration, and advanced packaging technologies, including TGV (Through Glass Via) and FOPLP (Fan-Out Panel Level Packaging) [9]. - Discussions will also cover challenges and innovations in semiconductor materials and equipment [9]. Registration and Fees - The registration fee is RMB 2500 per person, with early bird discounts available for those who register before October 31 [10]. - Special pricing is offered for students at RMB 1500 [10].

Core Viewpoint - The article highlights the significance of the 2025 Bay Area Semiconductor Industry Ecological Expo, showcasing advancements in semiconductor technology and the importance of collaboration in the industry [2][10]. Group 1: Event Overview - The 2025 Bay Area Semiconductor Industry Ecological Expo (Bay Chip Expo) commenced on October 17, 2023, at the Shenzhen Convention Center, attracting over 60 leading companies and institutions from more than 20 countries, with more than 48,300 professional visitors on the first day [2][10]. - The expo features a comprehensive display platform covering the entire industry chain, including technology research and development, process implementation, and industrial application [4][10]. Group 2: Focus Areas and Innovations - The expo emphasizes advanced packaging technologies, showcasing the transition from "continuing Moore's Law" to "beyond Moore's Law," with a complete industry chain map from materials and equipment to packaging applications [10]. - Key topics include heterogeneous integration, optoelectronic fusion, 3D heterogeneous integration, and advanced packaging technologies such as TGV (Through Glass Via) and FOPLP (Fan-Out Panel Level Packaging) [30]. Group 3: Industry Collaboration and Future Directions - The Ningbo Membrane Intelligence Information Technology Co., Ltd. is the sole registered entity for TrendBank, indicating a structured approach to industry collaboration [1]. - A significant conference on heterogeneous integration technology will be held from November 17-19, 2025, in Ningbo, aiming to foster collaboration and innovation in the semiconductor industry [30].

Core Insights - The article discusses the advancements and commercialization efforts of micro-transfer printing (μTP) technology, which is crucial for the integration of III-V materials on silicon substrates, enhancing photonic integrated circuits [2][5][6]. Group 1: μTP Technology Overview - μTP technology was developed by researchers at the University of Illinois in 2004 and has seen significant advancements, including the ability to transfer individual devices onto target photonic chips [2]. - The process involves using a PDMS stamp to pick and transfer devices, ensuring high alignment accuracy and allowing for large-scale parallel integration [3]. - μTP enables the integration of different materials on a common substrate without modifying the backend processes of silicon photonics [3]. Group 2: Commercialization Efforts - The INSPIRE project, running from 2021 to March 2025, focuses on commercializing wafer-level μTP technology, aiming to combine InP and SiN photonics on a single platform [5]. - Key partners in the INSPIRE project include Eindhoven University of Technology, imec, Smart Photonics, and Cambridge University, among others [5]. Group 3: Integration Challenges - The integration of III-V materials on silicon faces challenges due to lattice mismatch, which can lead to defects affecting the reliability of semiconductor lasers [6]. - Successful applications of single-chip methods in quantum dot devices have been reported, indicating potential for improved laser reliability [6]. Group 4: Upcoming Conference - TrendBank plans to host a conference from November 17-19, 2025, focusing on heterogeneous integration technologies, aiming to foster collaboration between industry and academia [9]. - The conference will cover advanced packaging technologies, including multi-material integration and photonic-electronic co-packaging [9].

Core Viewpoint - The article emphasizes the strategic opportunity in the new generation of chip development, highlighting the upcoming Heterogeneous Integration Annual Conference organized by TrendBank to foster advanced electronic information industry growth in Ningbo and the Yangtze River Delta region [5]. Group 1: Research Directions - The company is focusing on various research areas, including photolithography technology, advanced packaging, and polyimide materials, with specific reports scheduled for 2026 [2][3]. - A series of databases related to photolithography, polyimide projects, advanced IC substrates, advanced packaging, perovskite photovoltaics, and polarizers will be updated quarterly [3]. Group 2: Upcoming Conference - The Heterogeneous Integration Annual Conference will take place from November 17-19, 2025, with the theme "Focusing on the Frontier of Heterogeneous Integration Technology, Advancing the Journey of Advanced Packaging" [5]. - The conference will cover core technologies such as multi-material heterogeneous integration, optoelectronic co-packaging, wafer-level bonding, and advanced packaging techniques like TGV and FOPLP [5].

Core Insights - TrendBank is organizing various industry conferences to promote collaboration and innovation in the semiconductor and display technology sectors [3][4][10] - The company aims to enhance resource aggregation and industry cluster development in the Ningbo and Yangtze River Delta regions [10][11] Event Summaries - The 2025 TrendBank Display Technology and Supply Chain Industry Annual Conference will be held from November 19-21 in Chengdu, Sichuan [3] - The 2025 TrendBank Polarizer Industry Conference successfully gathered numerous enterprises to explore future development opportunities [4] - The 2025 TrendBank Lithography Industry Conference focused on the localization of lithography technology [4] - The 2025 TrendBank PI Conference and the HIPC 2025 event on heterogeneous integration were also successfully concluded [4] - In 2026, TrendBank plans to host a series of conferences focusing on advanced materials and technologies in the semiconductor industry [6][7][8] Future Plans - TrendBank will collaborate with the Yongjiang Laboratory to host the Heterogeneous Integration Annual Conference from November 17-19, 2025, focusing on advanced packaging technologies [10][11] - The conference will cover topics such as multi-material heterogeneous integration, optoelectronic co-packaging, and advanced packaging techniques like TGV and FOPLP [11]

Core Viewpoint - The article discusses the advancements and integration techniques in silicon photonics, emphasizing the importance of heterogeneous integration for the development of next-generation optical devices and systems [17]. Group 1: Heterogeneous Integration Techniques - Silicon itself does not emit light but is transparent at 1300nm and 1550nm, making it suitable for single-mode fiber transmission. The combination of silicon (Si) and silicon dioxide (SiO2) allows for the creation of various optical components [2]. - Grating couplers are highlighted as essential components that can rotate laser beams and couple them into silicon photonic (SiP) circuits, although they incur higher optical power loss [3]. - The addition of germanium (Ge) to silicon enables the detection of light at 1300nm and 1550nm, with SiGe technology being compatible with high-speed electronic devices [6]. - The unique properties of silicon-based modulators are crucial for the success of various SiP products, with modern CMOS technology driving this development [6]. Group 2: Integration Methods - Heterogeneous integration involves combining different material technologies into a single photonic integrated circuit (PIC), which can be achieved through processes like flip-chip bonding and micro-transfer printing [10][11]. - Flip-chip bonding requires precise alignment and can achieve high coupling efficiency, although it faces limitations in manufacturing throughput and cost reduction [11]. - Wafer bonding methods, including metal or oxide intermediate bonding and direct wafer bonding, are discussed, with direct bonding being more suitable for CMOS processes due to its lower temperature requirements [12]. Group 3: Upcoming Events and Industry Focus - TrendBank plans to host the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, focusing on advanced packaging technologies and fostering collaboration between industry and academia [17]. - The conference will cover topics such as multi-material heterogeneous integration, optoelectronic integration, and advanced packaging techniques, aiming to promote technological innovation and industry application [17].

Core Viewpoint - The article discusses the upcoming 2025 TrendBank Heterogeneous Integration Annual Conference, emphasizing the importance of heterogeneous integration technology in the semiconductor industry and its role in advancing the electronic information industry in Ningbo and the Yangtze River Delta region [2][4]. Event Details - The 2025 TrendBank Heterogeneous Integration Annual Conference will be held from November 17-19, 2025, in Ningbo, Zhejiang, focusing on the theme "Focusing on the Frontier of Heterogeneous Integration Technology" [2]. - Concurrently, the 8-inch verification line of the Ningbo Jiang Laboratory's information materials and micro-nano device preparation platform will be inaugurated and open for visits [2]. Conference Agenda - The conference will feature various sessions, including: - Closed-door meetings on heterogeneous integration [4]. - Keynote speeches from government leaders and organizers [4]. - Discussions on topics such as micro-nano devices, 2.5D/3D chip heterogeneous integration, and AI-driven integration opportunities [4][5][6]. Micro-Nano Platform Overview - The micro-nano platform at Ningbo Jiang Laboratory is a significant public research support service platform focused on "chip heterogeneous integration" and "micro-nano optics," aiming to provide comprehensive technological development and solutions for future industries like high-speed communication and autonomous driving [9]. - The platform has gathered 48 high-level research and management personnel and is equipped with advanced facilities, including a 6-inch R&D line and an 8-inch verification line, along with 165 high-end precision devices [11].

Core Viewpoint - The article emphasizes the importance of heterogeneous integration technology in the semiconductor industry, particularly in the context of new demands from artificial intelligence, intelligent driving, and high-performance computing applications. It highlights the upcoming 2025 Heterogeneous Integration Annual Conference organized by TrendBank and Yongjiang Laboratory to address these challenges and promote collaboration between industry and academia [2][10]. Conference Background - The conference will focus on the critical issues of chip power consumption, performance, area, and cost, which are driving the acceleration of emerging semiconductor technologies. Heterogeneous integration, including 2.5D/3D integration and advanced packaging, is identified as a key area for development [2]. - Ningbo is positioned as a core city for advanced manufacturing, with a strong foundation in the electronics industry, making it an ideal location for this conference [2]. Conference Details - The 2025 Heterogeneous Integration Annual Conference will take place from November 17-19, 2025, in Ningbo, Zhejiang, co-hosted by TrendBank and Yongjiang Laboratory, with support from local industry associations [4][10]. - The expected scale of the conference is between 300 to 500 participants, featuring a diverse agenda that includes keynote speeches, technical sessions, and roundtable discussions on various topics related to heterogeneous integration and advanced packaging technologies [4][6][10]. Agenda Highlights - The agenda includes discussions on micro-nano device applications, 2.5D/3D integration, MEMS processing technology, and advanced packaging solutions. Notable topics also cover optical chip innovations and the integration of photonic and electronic components [6][7][10]. - The conference aims to facilitate deep research exchanges and industry topic sharing, promoting the integration of technology and industry applications [10]. Participation and Fees - The registration fee for the conference is set at RMB 2500 per person, with early bird discounts available for those who register before October 31 [12]. - The conference aims to attract a wide range of participants from the semiconductor industry, including EDA tool developers, chip manufacturers, and research institutions [15]. Industry Collaboration - The conference seeks to create a collaborative ecosystem that integrates technology, industry, and capital, breaking down barriers across the semiconductor supply chain [11][13]. - It will feature a combination of large-scale meetings and smaller closed-door sessions to enhance interaction quality and facilitate targeted discussions [13].