Group 1 - The forum titled "2025 New Materials and Embodied Intelligent Hard Technology Innovation Forum" was successfully held in Shenzhen, focusing on the integration of new materials and embodied intelligence [1][2] - Nearly 200 representatives from various institutions and companies, including Huawei Cloud and the Chinese Academy of Sciences, participated to explore innovative paths and future opportunities in the field [1][2] - A new "Intellectual Property Protection Smart Hub Platform" for the new materials industry was launched, marking a significant breakthrough in Shenzhen's intellectual property service system [2][3] Group 2 - The platform integrates three professional service platforms: Patent Navigation Platform, Operation Public Service Platform, and Protection Workstation Service Platform, covering the entire innovation chain from pre-innovation to post-innovation [3][4] - The upgraded platform aims to provide comprehensive intellectual property services to support the high-quality development of Shenzhen's new materials industry [5] - The forum included a promotion segment for the Deep-Shan Special Cooperation Zone, highlighting its advantages in policy support, spatial resources, and industrial matching [5][6] Group 3 - Representatives from research enterprises, investment institutions, and application parties engaged in discussions about "technical bottlenecks" and "cross-border cooperation models," emphasizing the need for deep cross-border integration and shared R&D resources [7]