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同宇新材IPO迎来新进展,以电子树脂创新赋能覆铜板产业升级
Cai Fu Zai Xian· 2025-07-07 04:24
Group 1 - The copper-clad laminate industry in China is experiencing a trend of product structure upgrades, with lead-free, halogen-free, high-frequency, high-speed, and IC packaging becoming mainstream, leading to an expanding market size and promising industry prospects [1] - Tongyu New Materials (Guangdong) Co., Ltd. has gained attention as its IPO review status has changed to "registration effective" on the Shenzhen Stock Exchange's Growth Enterprise Market, reflecting its progress in line with industry trends [1][4] Group 2 - Tongyu New Materials focuses on the electronic resin sector, providing systematic resin solutions for the mid-to-high-end copper-clad laminate industry, meeting strict requirements for purity, performance, and stability [2] - The company has received several honors, including being recognized as a national-level "specialized and innovative" small giant enterprise and a champion demonstration enterprise in Guangdong's manufacturing sector, showcasing its strong capabilities in technology research and product quality [3] - With an experienced core management team, Tongyu New Materials is preparing for future development by mastering core technologies in lead-free, halogen-free, and high-speed electronic resins, aiming to enhance domestic production in high-end application areas [4]