Core Viewpoint - The article emphasizes the strategic importance of Chemical Mechanical Polishing (CMP) slurries in the semiconductor manufacturing process, highlighting the risks associated with reliance on foreign suppliers and the need for domestic alternatives in China [2][4][19]. Group 1: Market Overview - The global CMP slurry market has surpassed $2 billion, growing at a compound annual growth rate (CAGR) of approximately 8%, yet domestic market share in China for high-end slurries (14nm and below) is less than 10% [4]. - Major players in the global CMP slurry market include Cabot, Versum Materials, Hitachi, Fujimi, and Dow, which collectively hold nearly 80% of the market share, with Cabot alone accounting for about 33% [8][11]. Group 2: Domestic Market Dynamics - By 2025, China's 12-inch wafer production capacity is expected to account for approximately 25% of the global total, leading to a CMP slurry market projected to exceed 6 billion RMB [16]. - Currently, foreign brands dominate the high-end CMP slurry market in China, holding over 90% market share, which poses significant supply chain risks, cost pressures, and service response challenges [17][19]. Group 3: Technological Insights - Cerium oxide-based slurries are crucial for advanced CMP processes, providing a competitive edge in semiconductor manufacturing [14][22]. - The transition from traditional mechanical grinding to chemical etching in cerium oxide slurries enhances material removal efficiency and reduces defect rates, making it essential for high-performance applications [22][23]. Group 4: Future Outlook - To break through in the high-end CMP slurry market, collaboration among material companies, wafer manufacturers, and equipment suppliers is essential, alongside sustained investment and focus on key materials like nanosphere cerium oxide [26][27][28].