Core Viewpoint - World Advanced has signed a technology licensing agreement with TSMC for high-voltage (650V) and low-voltage (80V) GaN process technology, aiming to accelerate the development of next-generation GaN power components for various applications, enhancing its position in high-efficiency power conversion [2][3] Group 1: Technology Development - The licensing agreement will enable World Advanced to expand its GaN-on-Si process to high-voltage applications, providing a complete GaN-on-Si platform alongside its existing GaN-on-QST platform, making it the only company globally to offer both types of GaN wafer manufacturing services [2] - The development work is set to begin in early 2026, with mass production expected in the first half of 2028 [2] Group 2: Market Applications - GaN technology is becoming a key material for next-generation power technology due to its high efficiency, high power density, and miniaturization characteristics, addressing the limitations of traditional silicon-based processes [2] - World Advanced is constructing GaN process technology covering a range from 15V to 1200V, providing customers with flexible and competitive options [2] Group 3: Company Operations - World Advanced operates five 8-inch wafer fabs located in Taiwan and Singapore, with an average monthly capacity of approximately 286,000 8-inch wafers expected in 2025 [3] - The company and its subsidiaries employ over 7,000 people [3]