Core Viewpoint - The company aims to capitalize on the domestic semiconductor and new energy vehicle industries by raising 300 million yuan through an IPO on the Beijing Stock Exchange to enhance its semiconductor packaging materials production capacity and R&D capabilities [1] Group 1: Investment Projects and Capacity Expansion - The core project of the fundraising is the construction of a production line for 12,000 tons of key supporting materials for semiconductor packaging, with an investment of 200 million yuan in Mianyang, Sichuan [3] - Upon reaching full production, the new line will add 6,000 tons of epoxy molding compounds, 4,000 tons of liquid epoxy and epoxy film packaging materials, and 2,000 tons of silicone packaging materials, with increases of 54% and 35% in epoxy molding and liquid epoxy packaging materials capacity respectively compared to 2024 [3] - The project is strategically positioned to meet the growing demand in the semiconductor and new energy vehicle markets, allowing the company to seize market opportunities ahead of competitors [3] Group 2: Market Demand and Growth Potential - The global semiconductor packaging materials market is projected to reach 24.6 billion USD in 2024 and exceed 26 billion USD in 2025, with domestic market growth outpacing the global average [4] - The domestic new energy vehicle sales are expected to reach 12.866 million units in 2024, a year-on-year increase of 35.5%, driving significant demand for electronic packaging materials [4] - The company’s products have entered the supply chains of leading automotive companies such as BYD, with the automotive electronics sector projected to account for 24.80% of revenue in 2024, becoming a key growth driver [4] Group 3: Strategic Location and Synergy - The company has established a collaborative development framework with production bases in Wuxi, Jiangsu, and Mianyang, Sichuan, covering the entire supply chain from R&D to production and sales [5] - The Sichuan-Chongqing region has developed a complete industrial chain for integrated circuits, attracting major industry players, which enhances the company’s strategic positioning [5] - The establishment of subsidiaries in Shenzhen for sales and in Chengdu for new product R&D supports a nationwide layout, optimizing production capacity and reducing logistics costs [5]