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华海诚科2025财报出炉,环氧模塑、电子胶黏剂营收大增
DT新材料· 2026-03-22 16:04
Core Viewpoint - The article discusses the financial performance and operational developments of Jiangsu Huahai Chengke New Materials Co., Ltd. for the year 2025, highlighting both revenue growth and profit decline due to various factors in the semiconductor materials industry [3][4]. Group 1: Financial Performance - In 2025, the total revenue of Huahai Chengke reached 45.806 million yuan, representing a year-on-year increase of 38.12% [3][4]. - The total profit amounted to 2.006 million yuan, showing a year-on-year decline of 54.21%, while the net profit attributable to shareholders was 2.425 million yuan, down 39.47% year-on-year [4]. - The increase in revenue was driven by a favorable semiconductor industry environment and the consolidation of subsidiary Hengsuo Huawai, leading to a steady growth in order volume [4]. Group 2: Business Segments Epoxy Molding Materials - Revenue from epoxy molding materials reached 42.839 million yuan in 2025, a year-on-year growth of 35.61% [6]. - The company became a leader in domestic production and ranked second globally in shipment volume after consolidating Hengsuo Huawai, with annual production and sales exceeding 25,000 tons [6]. - The product range includes over 200 types of epoxy molding materials catering to various semiconductor packaging applications [6]. Adhesives - Revenue from adhesives was 2.781 million yuan, reflecting a significant year-on-year increase of 83.29% [8]. - The product line includes liquid electronic adhesives used in semiconductor IC packaging and various assembly applications [8]. Cleaning and Release Materials - Revenue from cleaning and release materials reached 0.161 million yuan, achieving a year-on-year growth of 100% [9]. - The company has developed cleaning and release materials for semiconductor packaging, which have passed customer assessments and entered mass production [9]. Group 3: Project Developments - The company’s initial public offering projects, including high-density integrated circuit and system-level module packaging epoxy materials, have reached the predetermined usable state [7]. - New production lines for low-alpha radiation epoxy molding materials have been successfully launched, and the construction of automotive-grade production lines is underway [7].