电子胶黏剂

Search documents
半导体再添并购动作,华海诚科11.2亿元收购获证监会批复,溢价率高达322%
Hua Xia Shi Bao· 2025-09-24 14:46
Group 1 - The core point of the news is that Huahai Chengke has received approval from the CSRC for a major asset restructuring plan, which involves acquiring 70% of Hengsu Huawai for a total price of 1.12 billion yuan, aiming to achieve 100% control post-transaction [2][3] - The acquisition is expected to propel Huahai Chengke from a domestic semiconductor packaging materials company to a world-class player in the industry, marking a significant leap in its development [3][4] - The acquisition comes with a high premium of 321.98%, raising concerns about potential goodwill impairment risks due to the absence of a performance compensation mechanism [5][6] Group 2 - Huahai Chengke's revenue from 2021 to 2024 shows fluctuations, with figures of 347 million yuan, 303 million yuan, 283 million yuan, and 332 million yuan respectively, indicating a decline in 2022 and 2023 [4] - The company's R&D expenses have been increasing year-on-year, with amounts of 18.29 million yuan, 24.64 million yuan, and 26.41 million yuan from 2022 to 2024, reflecting a commitment to innovation [4] - The company holds 31 invention patents and 84 utility model patents, emphasizing its focus on protecting core technologies and enhancing its competitive edge in the semiconductor packaging materials sector [4] Group 3 - The acquisition of Hengsu Huawai is part of a broader trend in the semiconductor industry, where mergers and acquisitions are accelerating due to the recovery of the global semiconductor market [7][8] - The demand for semiconductors is expected to grow continuously, driven by sectors such as smart vehicles, robotics, cloud computing, and artificial intelligence, which will further encourage companies to pursue mergers to meet market needs [9] - Experts predict that the trend of mergers and acquisitions in the semiconductor industry will persist for a considerable time, as domestic companies seek to catch up with international standards through strategic acquisitions [8][9]
华海诚科11.2亿收购加码主业获批 产品出货量有望破2.5万吨全球第二
Chang Jiang Shang Bao· 2025-09-22 23:09
长江商报消息 ●长江商报记者 沈右荣 历时11个月,华海诚科(688535.SH)的重大资产重组即将进入落地阶段。 9月21日晚,华海诚科发布公告,公司的重组方案获得中国证监会的批复同意。 根据华海诚科披露的重组方案(注册稿),华海诚科拟通过发行股份、可转债及支付现金相结合方式收 购衡所华威电子有限公司(以下简称"衡所华威")70%股权。同时,公司配套募资不超过8亿元,用于 支付本次交易的现金对价以及相关项目建设等。 其实,这是华海诚科收购衡所华威的第二步动作,第一步,已经闪电完成。2024年11月,华海诚科使用 超募资金4.8亿元先行收购了衡所华威30%股权。 收购衡所华威属于同业并购。华海诚科于标的公司主营业务均为半导体芯片封装材料料研发、生产和销 售,均为国家级专精特新"小巨人"企业。华海诚科称,重组完成后,公司在半导体环氧塑封料领域的年 产销量有望突破2.5万吨,跃居全球出货量第二位。 华海诚科收购衡所华威之前,A股公司德邦科技先行一步。 2024年5月,德邦科技开始与衡所华威的股东浙江永利、绍兴署辉接触收购事宜。当年9月,双方签订 《收购意向协议》,德邦科技拟收购衡所华威53%股权,标的公司100% ...
华海诚科:收购衡所华威70%股权获证监会批复 交易金额11.2亿元
Sou Hu Cai Jing· 2025-09-22 01:50
公告称,本次交易完成后,华海诚科在半导体环氧塑封料领域的年产销量有望突破2.50万吨,稳居国内 龙头地位,并跃居全球出货量第二位。通过整合双方技术优势,将加速推动高导热塑封料、存储芯片塑 封料等先进封装材料的研发及量产,打破国外技术垄断。 华海诚科是专注于半导体芯片封装材料的国家级专精特新"小巨人"企业,主要产品为环氧塑封料和电子 胶黏剂。截至9月19日收盘,公司股价报106.00元/股,当日上涨1.92%。 据公告,公司将以56.15元/股的发行价格,向绍兴署辉贸易有限公司等13名交易对象发行约569.90万股 股份,并发行480万张可转债,用于购买衡所华威70%股权,交易总金额为11.20亿元。募集配套资金将 用于支付现金对价、芯片级封装材料生产线技术改造、车规级芯片封装材料智能化生产线建设、研发中 心升级及补充流动资金等项目。 标的公司衡所华威是一家从事半导体芯片封装材料研发、生产和销售的国家级专精特新"小巨人"企业, 拥有世界知名品牌"Hysol",客户包括安世半导体、意法半导体、德州仪器等国际半导体领先企业以及 长电科技、华天科技等国内封测龙头企业。 核校:孙萍 ...
世界第三、国内第一的高分子龙头收购案,获通过!
DT新材料· 2025-09-14 16:05
Core Viewpoint - The article discusses the acquisition of 70% equity in Hengsuo Huawei Electronics Co., Ltd. by Huahai Chengke, which is a significant move in the semiconductor materials industry, particularly in the epoxy molding compound sector [2][3]. Group 1: Acquisition Details - Huahai Chengke plans to acquire 70% of Hengsuo Huawei for 1.12 billion yuan, valuing the company at 1.658 billion yuan, with the transaction approved by the Shanghai Stock Exchange's M&A review committee [2]. - The acquisition follows a previous agreement where Huahai Chengke acquired 30% of Hengsuo Huawei for 480 million yuan, using approximately 287 million yuan of over-raised funds [2]. - This acquisition is seen as a major milestone in the polymer materials sector, especially as it was nearly taken over by another leading company, Debang Technology [2]. Group 2: Company Overview - Hengsuo Huawei is recognized as the third-largest global producer of epoxy molding compounds and the leading domestic supplier, with a projected revenue of 460 million yuan in 2024 [3]. - The company specializes in various epoxy molding compounds used in semiconductor packaging, including black, gold, and transparent types, with advanced packaging products priced at approximately 251,000 yuan per ton [3][4]. - Huahai Chengke, established in December 2010, is a national-level "specialized and innovative" small giant enterprise, listed on the STAR Market with a market capitalization of 7.489 billion yuan [8]. Group 3: Financial Performance - In 2024, Huahai Chengke reported a revenue of 332 million yuan, a year-on-year increase of 17.21%, and a net profit of 40.803 million yuan, up 28.97% [9]. - The company experienced a decline in net profit in the first half of 2025, with a revenue of 179.076 million yuan, reflecting a year-on-year growth of 15.30%, but a net profit drop of 44.67% [9]. Group 4: Production Capacity - Hengsuo Huawei's production capacity for 2024 is projected at 12,959.10 tons, with a utilization rate of 96.93% and a sales volume of 12,463.17 tons [7]. - Huahai Chengke's acquisition is expected to boost its annual production capacity to over 25,000 tons, solidifying its position as a leader in the domestic market and the second-largest globally [6].
华海诚科: 江苏华海诚科新材料股份有限公司发行股份、可转换公司债券及支付现金购买资产并募集配套资金报告书(草案)(注册稿)(摘要)
Zheng Quan Zhi Xing· 2025-09-05 16:23
Summary of Key Points Core Viewpoint - Jiangsu Huahai Chengke New Materials Co., Ltd. plans to issue shares, convertible bonds, and cash to acquire 70% equity of Hengsuo Huawai Electronics Co., Ltd. from 13 shareholders, while raising supporting funds [1][12]. Group 1: Transaction Overview - The transaction involves the acquisition of 70% equity of Hengsuo Huawai Electronics Co., Ltd. through the issuance of shares, convertible bonds, and cash [12]. - The target company specializes in the research, production, and sales of epoxy encapsulation materials for semiconductor chips [12]. - The transaction price does not include the amount raised for supporting funds [12]. Group 2: Regulatory Compliance - The company and all directors, supervisors, and senior management guarantee that the information disclosed in this transaction does not contain false records, misleading statements, or significant omissions [2][3]. - The independent financial advisor and other related service institutions have confirmed the accuracy and completeness of the information provided in the transaction documents [4][9]. Group 3: Risk Management - The actual controller and related parties have committed to not transferring their shares in the company if any information related to the transaction is found to be misleading or false, pending investigation conclusions [2][3]. - The company assumes responsibility for any changes in operations and earnings resulting from the transaction [3]. Group 4: Financial and Legal Advisors - The independent financial advisor is CITIC Securities Co., Ltd., with legal counsel provided by Jiangsu Century Tongren Law Firm and auditing by Zhonghui Certified Public Accountants [4][9].
11家新材料中试基地获批(附名单)
DT新材料· 2025-08-26 16:03
Core Viewpoint - The establishment of 11 new material pilot bases in Shanghai, with a focus on chemical new materials, aims to enhance innovation and development in the industry [2][4]. Summary by Sections New Material Pilot Bases - Shanghai has set up 11 new material pilot bases, with 8 specifically related to chemical new materials [2][4]. - The pilot bases include various functions such as special chemicals, high-end metals, inorganic non-metals, and bio-manufacturing [4][5]. Specific Pilot Bases - Shanghai International Chemical New Materials Innovation Center focuses on electronic chemicals, bio-manufacturing, and green chemistry [5]. - Shanghai High-Performance Resin New Materials Pilot Base specializes in aerospace-grade resins, prepregs, and high-performance composite materials [5]. - Shanghai Nesting Chemical New Materials Pilot Base emphasizes micro-reaction continuous flow process development and special chemical pilot transformation [5]. - Shanghai Jinshan New Materials Incubator provides services for high-performance fibers, electronic chemicals, and special organic silicon [5]. - Shanghai Bokan Chemical's pilot base is dedicated to the pilot transformation of photoresist raw materials and resins [5]. - Shanghai Shisi Special Functional Materials Pilot Base offers services for special polyimides and electronic-grade resins [5]. - Shanghai Qianji New Materials Pilot Base focuses on lightweight magnesium alloy die-casting technology and hydrogen storage materials [5]. - Shanghai Yilang Alloy Materials Pilot Base is involved in the research and pilot testing of corrosion-resistant alloys and high-temperature alloys [5]. - Shanghai Inorganic Non-Metal New Materials Pilot Base works on ceramic materials for semiconductor applications and high-performance artificial crystals [5]. - Shanghai Biomanufacturing Bio-based New Materials Pilot Base specializes in recombinant peptide biomanufacturing and fermentation process scaling [5]. - Yexin Group's pilot base focuses on high-end film forming technology and composite material bonding technology [5]. Industry Events - The 2025 Polymer Industry Annual Conference and "New Plastic Award" evaluation will take place from September 10-12 in Hefei, Anhui [6][8]. - The conference will address the transformation and opportunities in the global chemical industry, emphasizing the rise of new industries in China [6][8]. - Various forums and discussions will cover topics such as engineering plastics, AI-enabled polymer material development, and innovations in aerospace and low-altitude economy materials [10][12][20][21].
威海银行 成功落地“产品碳足迹挂钩贷款”
Jing Ji Ri Bao· 2025-08-03 21:50
Core Viewpoint - Weihai Bank has successfully launched the "Product Carbon Footprint Linked Loan," providing 22 million yuan in credit support to a local chemical company, marking an innovation in green finance and contributing to the "dual carbon" goals [2] Group 1: Product Innovation - The "Product Carbon Footprint Linked Loan" ties the loan interest rate to the carbon footprint of the company's products, which includes the total greenhouse gas emissions during the production cycle [2] - The loan aims to incentivize companies to reduce carbon emissions by offering preferential interest rates if they meet or exceed pre-set fossil energy carbon emission targets [2] Group 2: Company Background - The local chemical company specializes in marine engineering anti-corrosion coatings, special functional coatings, and electronic adhesives [2] - The company has achieved a product carbon footprint report and green factory management system certification, enabling collaboration with a leading enterprise in the petrochemical industry [2] Group 3: Future Plans - Weihai Bank plans to continue developing green finance by providing customized, full-cycle financial solutions to support the green industry and enhance the competitiveness of enterprises in green development [3]
华海诚科: 江苏华海诚科新材料股份有限公司审阅报告及备考财务报表
Zheng Quan Zhi Xing· 2025-07-11 12:18
Company Overview - Jiangsu Huahai Chengke New Materials Co., Ltd. was registered on December 17, 2010, with a registered capital of RMB 29,249,905 in circulating A-shares and RMB 51,446,548 in unrestricted circulating A-shares [1][4] - The company was transformed from a limited liability company to a joint-stock company, maintaining the original shareholding proportions among shareholders [3][4] - The company’s stock was listed on the Shanghai Stock Exchange on April 4, 2023 [1] Capital Increases and Share Transfers - The company has undergone several capital increases, including a cash increase of RMB 600,000 by Jiangsu New Tide Technology Group [2][3] - Share transfers have occurred among various investors, including transfers to Jiangsu Yimeichi Investment Co., Ltd. and natural persons [2][3][5] - The company has issued shares and convertible bonds to acquire stakes in other companies, including a 30% stake in Hengsuo Huawai Electronics Co., Ltd. for a total transaction price of RMB 11.2 billion [10][14] Major Asset Restructuring - The company is engaged in a significant asset restructuring plan involving the acquisition of 70% of Hengsuo Huawai Electronics Co., Ltd. through a combination of issuing shares, convertible bonds, and cash payments [9][10] - The transaction is subject to approval from the Shanghai Stock Exchange and the China Securities Regulatory Commission [13] - The restructuring aims to enhance the company's market position in the electronic materials manufacturing industry, focusing on epoxy molding compounds and electronic adhesives [9][16] Financial Reporting and Accounting Policies - The company prepares its financial statements in accordance with the relevant accounting standards and regulations, reflecting its financial position and operating results accurately [16][20] - The company’s financial reports include a basis for preparation that assumes the completion of the restructuring transactions as of January 1, 2023 [17][18] - The company recognizes goodwill in its financial statements based on the excess of the purchase price over the fair value of identifiable net assets acquired [23][24]
华海诚科,环氧塑封料产量1.24万吨,同比增长20.40%
DT新材料· 2025-05-06 16:02
Core Viewpoint - The company Huahai Chengke reported a mixed financial performance for Q1 2025, with revenue growth but a significant decline in net profit due to increased costs related to employee stock incentives and depreciation from new facilities [1][2]. Financial Performance Summary - Q1 2025 revenue reached 83.87 million yuan, a year-on-year increase of 15.84% compared to 72.40 million yuan in the same period last year [2]. - Net profit attributable to shareholders decreased by 43.56% to 7.21 million yuan from 12.77 million yuan year-on-year [2]. - The company's net profit after excluding non-recurring items fell by 48.97% to 6.56 million yuan from 12.86 million yuan year-on-year [2]. Annual Performance Overview - For the full year 2024, Huahai Chengke achieved a revenue of 332 million yuan, up 17.23% from 283 million yuan in 2023 [3]. - The net profit attributable to shareholders for 2024 was 40.06 million yuan, reflecting a 26.63% increase from 31.64 million yuan in 2023 [3]. - The net profit after excluding non-recurring items rose by 24.59% to 34.13 million yuan from 27.40 million yuan year-on-year [3]. Product and Market Insights - Huahai Chengke specializes in the research, production, and sales of epoxy molding compounds and electronic adhesives, primarily used in semiconductor packaging and board-level assembly [4]. - The production of epoxy molding compounds reached 12,400 tons in the reporting period, marking a 20.40% increase, with revenue from this segment at 316 million yuan, up 18.81% [4]. - The adhesive segment saw a production decline of 20.92% to 36.23 tons, but revenue increased by 8.44% to 15 million yuan, with a gross margin of 35.05%, down 7.02 percentage points from the previous year [4]. Strategic Initiatives - The company is planning to acquire 100% of Hengsu Huawai through a combination of cash and stock issuance, which is expected to enhance production scale and efficiency [5]. - A project to build a high-density integrated circuit and system-level module packaging epoxy molding compound facility is underway, with an expected annual production capacity of 11,000 tons upon completion [5]. - As of the reporting period, the company has invested 184 million yuan in fundraising projects, achieving 63.83% of the planned progress [5].
江苏华海诚科新材料股份有限公司2024年年度报告摘要
Shang Hai Zheng Quan Bao· 2025-04-22 19:48
Company Overview - The company is dedicated to the research, production, and sales of semiconductor packaging materials, specifically epoxy molding compounds and electronic adhesives, and is one of the few specialized factories in China for chip-level solid and liquid packaging materials [8][9] - The main products include epoxy molding compounds and electronic adhesives, which are widely used in semiconductor packaging and board-level assembly [9][12] Business Model - The company employs a research and development model focused on optimizing the formulation and production processes of semiconductor packaging materials [10] - The procurement model involves a dedicated procurement department that collaborates with various departments to select suppliers and manage material needs [10] - The production model combines sales-driven production with demand forecasting to ensure alignment between production plans and sales [11] - The sales model is customer-centric, primarily targeting direct customers while also engaging with trading partners, with a strong sales presence in East China, Southwest China, and South China [11] Industry Position - Since its establishment in 2010, the company has focused on the R&D and industrialization of semiconductor packaging materials, achieving significant technological advancements and market recognition [19] - The company is recognized as a national high-tech enterprise and has established stable partnerships with leading industry players, enhancing its market share and brand influence [19] Financial Performance - In the reporting period, the company achieved operating revenue of 331.63 million yuan, a year-on-year increase of 17.23%, and a net profit attributable to shareholders of 40.06 million yuan, up 26.63% year-on-year [24] Profit Distribution Plan - The company plans to distribute a cash dividend of 2.00 yuan per 10 shares (including tax) for the 2024 fiscal year, with a total proposed cash dividend amounting to approximately 24.13 million yuan, representing 60.23% of the net profit attributable to shareholders [55][54]