Core Viewpoint - The article discusses the evolution of cooling technologies in response to increasing chip power densities, highlighting the limitations of traditional copper cooling solutions and the emergence of advanced materials like diamond and graphene composites for effective thermal management [2][4][28]. Group 1: Chip Power Trends - The power consumption of GPUs has escalated from 700W to 1400W, with future models potentially reaching 4000W, necessitating a shift from optional to mandatory liquid cooling solutions [4][10]. - The maximum system power for cabinets is projected to increase from approximately 140kW to around 600kW by 2027, indicating a significant rise in thermal management challenges [3][4]. Group 2: Material Limitations and Innovations - Traditional pure copper cooling solutions have a thermal conductivity of 380-400 W/mK, which may not suffice for the heat dissipation required at higher power levels, leading to potential heat accumulation [5][28]. - The article emphasizes the need for new materials as traditional metals reach their physical limits, with a focus on high thermal conductivity composite materials like diamond and graphene [8][28]. Group 3: Advanced Cooling Technologies - The evolution from single-phase to two-phase cooling technologies is highlighted, with companies like 双鸿科技 proposing a roadmap for material optimization in thermal management [8][10]. - Diamond composites can achieve thermal conductivities of 600-800 W/mK, significantly enhancing heat dissipation capabilities compared to copper [11][12]. - Graphene-copper composites are positioned as a key technology for 2025-2026, offering improved thermal performance while maintaining compatibility with existing manufacturing processes [21][22]. Group 4: Future Directions in Thermal Management - The article suggests a trend towards heterogeneous integration in cooling solutions, where different materials are used strategically across various components to optimize thermal management [28]. - The use of composite phase change materials (CPCM) is proposed as a method to absorb transient heat spikes, providing additional thermal stability during peak loads [27][28].