Core Viewpoint - The company has established a comprehensive product matrix in the silicon-based semiconductor field, including various cutting and slicing machines, and is actively developing additional related products [1] Group 1: Product Development and Orders - The company has successfully formed bulk orders for semiconductor cutting machines and 6-inch and 8-inch semiconductor wire slicing machines [1] - The 8-inch semiconductor wire slicing machine has been sold overseas, and the chamfering machine has achieved sales with leading customers [1] - A 12-inch semiconductor wire slicing machine has been launched and is currently in trial use with industry-leading clients [1] Group 2: Silicon Carbide Product Line - In the silicon carbide sector, the company has developed silicon carbide wire slicing machines, chamfering machines, and thinning machines [1] - Bulk orders have been formed and large-scale deliveries have been achieved for 6-inch and 8-inch silicon carbide wire slicing machines [1] - The silicon carbide thinning machine is currently undergoing customer material testing [1] Group 3: Integrated Solutions - The company aims to provide more high-quality and efficient equipment solutions by continuously optimizing and upgrading existing products and actively developing new products [1] - The focus is on integrated solutions for the semiconductor industry, particularly in cutting, chamfering, and grinding [1]