8月27日，晶方科技盘中上涨2.06%，截至11:24，报33.15元/股，成交9.29亿元，换手率4.37%，总市值 216.19亿元。 责任编辑：小浪快报 晶方科技所属申万行业为：电子-半导体-集成电路封测。所属概念板块包括：机器视觉、光刻机、第三 代半导体、生物识别、中盘等。 截至6月30日，晶方科技股东户数13.69万，较上期增加19.44%；人均流通股4762股，较上期减少 16.28%。2025年1月-6月，晶方科技实现营业收入6.67亿元，同比增长24.68%；归母净利润1.65亿元，同 比增长49.78%。 分红方面，晶方科技A股上市后累计派现4.96亿元。近三年，累计派现1.30亿元。 机构持仓方面，截止2025年6月30日，晶方科技十大流通股东中，东吴移动互联混合A（001323）位居 第二大流通股东，持股1445.75万股，相比上期减少150.85万股。国联安中证全指半导体产品与设备ETF 联接A（007300）位居第三大流通股东，持股691.65万股，相比上期增加65.70万股。南方中证1000ETF （512100）位居第四大流通股东，持股602.21万股，相比上期增加114.21万 ...

Core Viewpoint - The company, Jingfang Technology, is experiencing a significant recovery in its performance, driven by growth in its packaging business and expanding applications in automotive intelligence, robotics, and AI glasses [1][3]. Group 1: Financial Performance - In 2023, the company achieved a revenue of 1.13 billion yuan, representing a year-on-year increase of 23.72%, and a net profit attributable to shareholders of 253 million yuan, up 68.4% [1]. - In the first quarter of 2024, the net profit attributable to shareholders reached 65 million yuan, marking a year-on-year growth of 32.73% [1]. - The revenue from chip packaging and testing increased by approximately 30% due to the growth in orders and shipments in the automotive CIS sector [1]. Group 2: Business Expansion and Innovation - The company is focusing on expanding its MEMS and FILTER applications beyond CIS, aiming for commercial mass production [1][3]. - The company is actively developing new products in the automotive intelligent projection field and enhancing its optical device capabilities through its optical centers in the Netherlands and Suzhou [2]. - The company is positioned as a leader in wafer-level silicon through-hole packaging technology for automotive camera chips, benefiting from the rapid development of automotive intelligence and autonomous driving technologies [1][3]. Group 3: Market and Global Strategy - The company is adjusting its investment structure for overseas subsidiaries and projects to build an international financing platform, leveraging its Singapore subsidiary [4]. - The construction of a production base in Penang, Malaysia, is underway to better meet overseas customer demands and promote process innovation [4]. - The company is advancing its participation in national key research projects, specifically in the MEMS sensor chip advanced packaging testing platform [3].