超低粗度铜箔(HVLP)
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PCB成为算力隐形主角 迎接AI时代黄金十年
Jing Ji Ri Bao· 2025-10-27 23:57
Core Insights - The 2025 Taiwan Printed Circuit Board Exhibition (TPCA Show) concluded with industry leaders optimistic about the future, driven by the explosive demand for AI servers and high-performance computing, indicating that "PCBs will usher in a golden decade" [1] - The role of PCBs is evolving from merely connecting signals to becoming system carriers, necessitating larger sizes, higher layers, and stricter thermal and signal integrity requirements due to AI server integration [2] - Taiwan's PCB industry holds a strategic position globally, with significant market shares in semiconductor and packaging sectors, expected to increase further with the acceleration of AI and heterogeneous integration [3] Industry Trends - The AI trend is positioning PCBs as a trillion-dollar industry in Taiwan, expected to grow alongside the semiconductor sector [4] - The surge in demand for high-end PCBs due to AI servers has exposed material supply bottlenecks, particularly for high-performance glass fiber cloth and ultra-low profile copper foil [5] - Taiwanese PCB manufacturers are actively collaborating with material and equipment suppliers to optimize processes and develop new materials, forming a new industrial ecosystem [6] Expansion and Investment - Major Taiwanese PCB companies are expanding production capacities in response to the increasing demand driven by AI, with companies like 臻鼎-KY and 台光电 planning significant capacity increases [7] - 臻鼎-KY is expanding its high-end production capabilities in China, Thailand, and Kaohsiung, while 台光电 aims to increase its capacity by 70% over the next three years [7]