| | 1、公司目前已与哪些晶圆原厂建立了长期晶圆供应合 | | --- | --- | | | 作？公司合作对象是否涵盖长江存储与长鑫存储？公司目 | | | 前的晶圆库存和供应安排，能否满足未来业务发展和客户订 | | | 单的需求？公司是否有计划在未来签署较大金额的晶圆采 | | | 购协议？ | | | 答：公司已与包括长江存储、长鑫存储在内的多家国内 | | | 国际晶圆原厂建立了长期、稳定且深度的战略合作关系。基 | | | 于已落地的供应协议安排（长期供货协议等）及高效的库存 | | | 管理机制，公司当前晶圆保障能力不仅能够有力支撑业务的 | | | 稳定运行，也能充分满足公司向 AI 服务器、AI 端侧等领域 | | | 拓展的战略需求，供应链整体具备高度的稳定性与韧性。公 | | | 司将依托与原厂的深度合作优势，综合考量市场供需格局、 | | | 客户需求等因素，择机推进兼顾短期成本效益与长期战略价 | | | 值的采购合作安排。 | | 投资者关系活动 | 2、OpenClaw 等新型 AI 应用在端侧设备上的加速落地， | | 主要内容介绍 | 将如何影响AI端侧存储的市场格局？公司 ...

Group 1: Market Position and Product Development - The company ranks third in the total capacity of enterprise-grade SATA SSDs in China for 2024, and first among domestic brands according to IDC data [3] - The company has successfully introduced SOCAMM products, which are designed for AI servers, achieving over 2.5 times the bandwidth and approximately 20% lower latency compared to traditional RDIMM [3] - The company has deployed over 80 million units of its main control chips by the end of July, with rapid growth in deployment scale [4] Group 2: Strategic Partnerships and Business Models - The company has established a TCM (Technology Contract Manufacturing) model, which connects wafer manufacturers directly with core downstream customers, reducing the complexity of traditional storage module business models [4] - A strategic partnership with SanDisk has been formed to launch customized high-quality UFS products and solutions for the mobile and IoT markets [6] - The TCM model has shown good demonstration effects and is expected to achieve breakthroughs in cooperation with more manufacturers and Tier 1 customers [4] Group 3: Product Performance and Future Plans - The UFS4.1 products equipped with self-developed main control chips achieve sequential read/write speeds of 4350MB/s and 4200MB/s, and random read/write performance of 630K IOPS and 750K IOPS, significantly outperforming mainstream market products [5] - The company is preparing for the development of the next generation of main control chips to meet the increasing performance demands of AI terminals [5] - The company has launched new embedded products such as UFS4.1, eMMC Ultra, and QLC eMMC, leveraging its self-developed technologies to meet market demands [6]