| | 1、公司目前已与哪些晶圆原厂建立了长期晶圆供应合 | | --- | --- | | | 作？公司合作对象是否涵盖长江存储与长鑫存储？公司目 | | | 前的晶圆库存和供应安排，能否满足未来业务发展和客户订 | | | 单的需求？公司是否有计划在未来签署较大金额的晶圆采 | | | 购协议？ | | | 答：公司已与包括长江存储、长鑫存储在内的多家国内 | | | 国际晶圆原厂建立了长期、稳定且深度的战略合作关系。基 | | | 于已落地的供应协议安排（长期供货协议等）及高效的库存 | | | 管理机制，公司当前晶圆保障能力不仅能够有力支撑业务的 | | | 稳定运行，也能充分满足公司向 AI 服务器、AI 端侧等领域 | | | 拓展的战略需求，供应链整体具备高度的稳定性与韧性。公 | | | 司将依托与原厂的深度合作优势，综合考量市场供需格局、 | | | 客户需求等因素，择机推进兼顾短期成本效益与长期战略价 | | | 值的采购合作安排。 | | 投资者关系活动 | 2、OpenClaw 等新型 AI 应用在端侧设备上的加速落地， | | 主要内容介绍 | 将如何影响AI端侧存储的市场格局？公司 ...

Core Insights - The storage chip sector is experiencing a continuous increase in market demand, with Jiangbolong revealing key developments in mSSD applications, UFS4.1 product collaborations, wafer supply assurance, and storage cycle outlooks during investor discussions [1] Group 1: mSSD Development - Jiangbolong's mSSD, utilizing Wafer-level System-in-Package (SiP) technology, integrates multiple components into a single package, offering significant manufacturing cost advantages while maintaining performance comparable to traditional SSDs [3] - The mSSD is being rapidly adopted by leading PC manufacturers, with analysts noting its potential as the standard storage solution for next-generation mobile computing platforms due to increasing demands from AI PCs for space and power efficiency [3] Group 2: UFS4.1 Product Capabilities - Jiangbolong is among a few global companies capable of developing UFS4.1 products at the chip level, with its self-developed controller offering superior performance in terms of process, read/write speed, and stability compared to comparable market products [3] - UFS4.1 is positioned as a premium storage option for Tier 1 clients' flagship smart terminal models, with mass shipments expected to commence soon [3][4] Group 3: Supply Chain Resilience - Jiangbolong has established deep cooperative relationships with major wafer manufacturers and leading smart terminal device companies, paving the way for large-scale commercialization of UFS4.1 [4] - The company has signed long-term supply agreements and commercial memorandums with global wafer suppliers, enhancing its supply chain resilience amid structural tensions in storage wafer supply [5] Group 4: Market Outlook - Jiangbolong anticipates a positive trend in storage prices, driven by structural changes in demand due to AI applications and the rapid expansion of AI infrastructure, coupled with a shortage of HDD supply [5] - The company highlights that the capital expenditure recovery of storage manufacturers will have limited short-term contributions to output growth due to the lag in capacity construction cycles [5]

Group 1: Market Performance - As of February 10, 2026, the Shanghai Composite Index rose by 0.13% to close at 4128.37 points, while the Shenzhen Component Index increased by 0.02% to 14210.63 points. The ChiNext Index fell by 0.37% to 3320.54 points [1] - In the overnight U.S. market, the Dow Jones Industrial Average increased by 0.10%, while the Nasdaq Composite Index decreased by 0.59% and the S&P 500 Index fell by 0.33%. The Philadelphia Semiconductor Index dropped by 0.68% [1] Group 2: Company News - Semiconductor manufacturer SMIC (688981.SH) reported a revenue of 17.813 billion yuan for Q4 2025, representing a year-on-year growth of 11.9%. The net profit attributable to shareholders was 1.223 billion yuan, up 23.2% year-on-year. However, total profit decreased compared to the previous year due to rising financial costs and declining investment income [2] - Jiangbolong (301308) indicated during an institutional survey that only a few companies globally can develop UFS4.1 products at the chip level. Their self-developed UFS4.1 products outperform comparable market products in terms of process, read/write speed, and stability. UFS4.1 is a high-end consumer storage product and is the preferred storage configuration for Tier 1 flagship smart terminal models, indicating a broad market potential [2] Group 3: Industry Insights - Donghai Securities projected that the combined capital expenditure of the four major U.S. CSPs will exceed 670 billion dollars in 2026, marking a significant year-on-year increase of over 60%. The demand for computing power is expected to experience explosive growth driven by the ongoing penetration of AI into end-user applications and the evolution of AIAgent technology [3] - The Sci-Tech Innovation Semiconductor ETF (588170) tracks the Shanghai Stock Exchange's semiconductor materials and equipment theme index, focusing on hard-tech companies in semiconductor equipment (60%) and materials (25%). The semiconductor equipment and materials industry is crucial for domestic substitution, benefiting from the AI revolution and advancements in lithography technology [3]

Group 1: Market Performance - The Shanghai Composite Index rose by 0.13% to close at 4128.37 points, while the Shenzhen Component Index increased by 0.02% to 14210.63 points. The ChiNext Index fell by 0.37% to 3320.54 points [1] - In the overnight U.S. market, the Dow Jones Industrial Average increased by 0.10%, while the Nasdaq Composite Index decreased by 0.59% and the S&P 500 Index fell by 0.33% [1] Group 2: Company News - SMIC (688981.SH) reported a revenue of 17.813 billion yuan for Q4 2025, a year-on-year increase of 11.9%. The net profit attributable to shareholders was 1.223 billion yuan, up 23.2% year-on-year. The decrease in total profit compared to the previous year was mainly due to increased financial expenses and decreased investment income [2] - Jiangbolong stated that only a few companies globally, including itself, have the capability to develop UFS4.1 products at the chip level. The UFS4.1 product, which is a high-end consumer storage solution, is expected to have a broad market space and is already on the verge of mass shipment [2] Group 3: Industry Insights - Donghai Securities projected that the capital expenditure of the four major CSPs in the U.S. is expected to exceed 670 billion dollars in 2026, representing a year-on-year increase of over 60%. The demand for computing power is anticipated to grow explosively due to the ongoing penetration of AI into end-user applications [3] - The Sci-Tech Innovation Semiconductor ETF (588170) tracks the semiconductor materials and equipment theme index, focusing on companies in the semiconductor equipment (60%) and materials (25%) sectors. This industry is crucial for domestic substitution and is expected to benefit from the AI revolution and advancements in lithography technology [3]

Group 1: Product Innovation - The company's new product, mSSD, utilizes wafer-level system-in-package (SiP) technology, integrating multiple components into a single package, which significantly reduces manufacturing costs and enhances performance [3] - mSSD is positioned as an upgraded form of traditional SMT SSDs, offering compactness and low power consumption while maintaining performance levels comparable to traditional SSDs, indicating a broad market potential [3] Group 2: Strategic Partnerships - The company is among a few globally capable of developing UFS4.1 products at the chip level, with its UFS4.1 products outperforming market competitors in terms of process, read/write speed, and stability [3] - The company has established deep cooperative relationships with major wafer suppliers, supported by long-term supply agreements, ensuring a robust supply chain even in tight market conditions [3] Group 3: Market Trends - The demand for storage is expected to surge due to the structural changes in AI inference systems and the rapid expansion of AI infrastructure, coupled with HDD supply shortages [4] - The capital expenditure recovery of storage manufacturers will have limited short-term impact on output growth due to the lag in capacity construction [4] Group 4: Disclosure Compliance - The investor relations activity did not involve any undisclosed significant information [4]

Group 1 - The global storage market is expected to experience a disruptive price increase starting from Q3 2025, with DRAM and NAND flash prices rising over 300% [1] - Predictions indicate that NAND flash prices will increase by 33%-38% and general DRAM prices by 55%-60% in Q1 2026 [1] - 25 out of 41 storage companies have disclosed earnings forecasts, with 16 companies expecting positive results, driven by the AI and computing industry [1] Group 2 - The price surge is attributed to a structural supply-demand imbalance caused by AI, with AI servers consuming 53% of global memory monthly production [1] - Major manufacturers are shifting over 80% of their advanced production capacity to high-margin HBM, leading to a reduction in mature capacity [1] - The average inventory cycle for the DRAM industry is projected to drop to 10 weeks, indicating a tight supply situation [1] Group 3 - Domestic companies like Changxin Technology and Yangtze Memory are expected to benefit from increased opportunities in DDR4 and 3D NAND products due to foreign manufacturers focusing on high-end production [2] - Baiwei Storage anticipates revenues of 10 to 12 billion yuan in 2025, with a net profit increase of 427.19% to 520.22% [2] - Demingli expects revenues of 10.3 to 11.3 billion yuan in 2025, with a net profit increase of 85.42% to 128.21% [2] Group 4 - The company Shannon Chip Innovation expects over 40% revenue growth in 2025, with its brand "Haipu Storage" entering mass production [3] - The current market is viewed as a "super cycle" lasting 2-3 years, with supply capacity lagging behind demand growth [3] - Citigroup predicts average price increases of 88% for DRAM and 74% for flash products in 2026, higher than previous forecasts [3] Group 5 - Companies are focusing on inventory management and supply stability, with Baiwei Storage maintaining sufficient inventory levels [4] - Demingli plans to raise up to 3.2 billion yuan for SSD and DRAM expansion projects [4] - Several companies are pursuing acquisitions to enhance product lines and supply capabilities, such as Yingxin Development's acquisition of Guangdong Changxing Semiconductor [5]

Core Viewpoint - Jiangbolong's UFS4.1 is positioned as a high-end consumer storage product, preferred by Tier 1 clients for flagship smart terminal models, indicating significant market potential [1] Group 1: Product Development - UFS4.1 is currently developed by only a few companies at the chip level, showcasing a competitive edge in the market [1] - The company’s self-developed UFS4.1 product outperforms comparable market products in terms of process, read/write speed, and stability [1] Group 2: Market Recognition - The UFS4.1 product has received recognition from major storage manufacturers like SanDisk and several Tier 1 clients, indicating strong market acceptance [1] - The product introduction process is accelerating, suggesting a positive outlook for market penetration [1]

Group 1: Product Innovations - The mSSD product utilizes Wafer-level System-in-Package (SiP) technology, integrating multiple components into a single package, which significantly reduces manufacturing costs by eliminating several SMT processes [3] - mSSD offers a compact design that meets low power consumption requirements while maintaining performance levels comparable to traditional SSDs, indicating a broad market potential [3] - The UFS4.1 product is positioned as a high-end storage solution for Tier 1 customers, with limited global competition in chip-level development, enhancing its market prospects [3] Group 2: Market Trends and Demand - The current storage upcycle is expected to be driven by increased demand for SSDs from cloud service providers due to AI technology applications and a shortage of HDD supply [3] - The transition from HDD to SSD by cloud service providers is anticipated to significantly boost NAND Flash demand, although capacity expansion may lag behind this demand [3] - Future capital expenditure increases from manufacturers may have limited impact on output growth in 2026 due to the inherent delays in capacity construction [3] Group 3: Investor Relations Activity - The investor relations activity took place on January 8, 2026, with participation from several investment firms, indicating strong interest in the company's developments [2] - The meeting was led by the Investor Relations Manager and a Senior Supervisor, highlighting the company's commitment to transparent communication with investors [2] - No undisclosed significant information was involved in this activity, ensuring compliance with disclosure regulations [3]

Group 1: Product Innovations - The company's new product, mSSD, integrates multiple components into a single package, offering significant cost advantages over traditional SSDs [3] - mSSD provides TB-level capacities and meets high-performance standards for PCIe interfaces, making it suitable for diverse storage applications [3] - The innovative design of mSSD includes a tool-free expansion feature, enhancing compatibility and user experience [3] Group 2: Market Opportunities - The market for UFS4.1 products is expanding, especially as major competitors like Micron exit the consumer storage market [3][4] - The company is one of the few capable of developing UFS4.1 products at the chip level, with its offerings recognized by major Tier 1 clients [3] - The demand for NAND Flash is expected to surge due to AI applications and a shift from HDD to SSD among cloud service providers [4] Group 3: Pricing Trends - Predictions indicate that prices for Mobile eMMC/UFS may rise by 25%-30% in Q1 2026, with LPDDR4X/5X expected to increase by 30%-35% [4] - The price of PC DDR5/LPDDR5X is also projected to rise by 30%-35%, while cSSD prices may increase by 25%-30% [4] Group 4: Future Developments - The company plans to design high-performance controller chips for UFS, eMMC, SD cards, and PCIe SSDs, enhancing its product competitiveness [4] - The company will adopt a Fabless model for its chip architecture and firmware development [4]

Group 1: Market Demand and Supply Dynamics - The demand for high-performance TLC eSSD and QLC eSSD is driven by the continuous application of AI technology in cloud services, coupled with a shortage of HDD supply, leading to a surge in NAND Flash demand [3] - Major manufacturers are maintaining a cautious capacity expansion strategy, which may limit the incremental contribution to output in 2026 due to the lag in capacity construction [3] Group 2: Supply Chain and Inventory Management - The company has established long-term direct cooperation with major global storage wafer manufacturers, ensuring a competitive advantage in the supply chain [3] - Long-term supply agreements (LTA) and memorandums of understanding (MOU) are in place to ensure a stable supply of storage wafers [3] Group 3: Profitability and Business Model - The production cycle from wafer procurement to memory sales means that rising wafer prices will positively impact the company's gross margin [3] - The company has made significant breakthroughs in high-end storage, overseas business, and self-developed main control chips, which will drive profitability growth [3] Group 4: TCM Model and Future Prospects - The TCM model, which integrates the entire supply chain from chip development to packaging, is gaining recognition from major Tier 1 customers [3] - The TCM model's customer acceptance is expected to increase during periods of rising storage prices, with ongoing acceleration in its implementation [4]