Core Viewpoint - The article discusses the recent announcement by zycgr regarding government procurement intentions for various instruments, with a total budget of 659 million yuan, highlighting significant investment opportunities in the instrumentation sector [2][3]. Summary by Sections Procurement Overview - zycgr has released procurement intentions for 22 types of instruments, with a total budget of 659 million yuan, expected to be procured by November 2025 [3][6]. Instrument Descriptions - **X-ray Photoelectron Spectroscopy (XPS)**: A surface analysis tool that utilizes the photoelectric effect to analyze the energy distribution of emitted photoelectrons, providing information on surface elements, chemical states, and relative content. It can detect all elements except H and He, making it crucial in materials science and nanotechnology [4]. - **Glow Discharge Optical Emission Spectroscopy (GD-OES)**: An elemental analysis instrument that uses glow discharge to excite surface elements, allowing for the analysis of elemental composition and concentration variations with depth. It is essential for modern material characterization [5]. Specific Instrument Procurement Details - **12-inch Rapid Annealing Furnace**: Budget of 20 million yuan, used for III-V materials metallization and oxygen vacancy adjustment [7]. - **12-inch Vacuum Annealing Furnace**: Budget of 20.7 million yuan, primarily for post-bonding annealing [7]. - **High-Density Plasma (HDP) CVD**: Budget of 3.2 billion yuan, used for aluminum interconnect processes and deposition of materials like Al/TiN/Ti [7]. - **Dynamic Ignition Test Unit**: Budget of 6.1 billion yuan, includes systems for high-temperature flame control and in-situ characterization under extreme service conditions [8]. Additional Instrumentation - **Hydrogen Combustion Wideband Multi-Dimensional Optical Testing Device**: Budget of 4.8 billion yuan, includes systems for high-pressure combustion and control management [9]. - **Superconducting Low-Temperature System**: Budget of 4.39 billion yuan, includes components for helium circulation and cooling systems for superconducting modules [9]. Conclusion - The procurement intentions reflect a significant investment in advanced instrumentation, indicating potential growth and opportunities within the industry, particularly in materials science and nanotechnology applications [2][3].

Core Insights - The article discusses the successful completion of the "Semiconductor Material Testing Technology Forum" held on September 10, 2025, during the BCEIA 2025 event, featuring nine expert speakers who explored various aspects of semiconductor material testing and failure analysis [2][5]. Group 1: Forum Overview - The 21st Beijing Conference & Exhibition on Instrumental Analysis (BCEIA 2025) took place at the China International Exhibition Center, marking the 40th anniversary of BCEIA, with a theme focused on academic exchange and instrument exhibitions [3][34]. - The forum attracted over 300 industry professionals, both online and offline, highlighting the growing interest in semiconductor material testing [5]. Group 2: Key Presentations - Lin Miaoling from the Chinese Academy of Sciences presented on the characterization of in-plane anisotropic semiconductors using angle-resolved Raman spectroscopy, emphasizing the impact of sample thickness and substrate on Raman tensor properties [8]. - Xi Shanbin from the National Semiconductor Device Quality Inspection Center discussed the importance of semiconductor device testing and failure analysis, detailing various testing methods and their significance in product development and quality control [11]. - Ding Xin from HORIBA China showcased the application of optical spectroscopy technologies in semiconductor material characterization, highlighting the importance of high spectral resolution and sensitivity [14]. - Xu Wentao from Suzhou Laboratory discussed the development of testing capabilities for electronic chemicals, focusing on the application of domestic instruments in the semiconductor industry [17]. - Peng Jinlan from the University of Science and Technology of China presented on the development of in-situ silicon nitride thermoelectric chips for scanning electron microscopy, demonstrating their advantages over traditional sample stages [20]. - Hua Younan from Shengke Nano introduced a comprehensive failure analysis method for wafer-level quality control, advocating for the establishment of national standards to enhance quality management in semiconductor manufacturing [23]. - Li Chenhui from Beijing Xinlifang Technology Development Co., Ltd. analyzed the current state and trends of the semiconductor material testing industry from a big data perspective, emphasizing the rapid growth in demand for third-party testing services [26]. - Ma Hongtao from Beijing Software Product Quality Testing and Inspection Center discussed the common failure analysis equipment used in material research, highlighting the interdependence of failure analysis and material characterization [29]. - Ding Yang from the Chinese Academy of Sciences emphasized the critical role of Transmission Electron Microscopy (TEM) and Focused Ion Beam (FIB) technologies in analyzing semiconductor materials and devices, showcasing their applications in various fields [32].