摘要 ： 近日，zycgr发布多批政府采购意向，仪器信息网特对其中的仪器设备品目进行梳理，统计出22 项仪器设备采购意向，预算总额达6.59亿元。 详细采购清单 （详情点击文末阅读原文） ： Z ycgr 2025年11月 仪器设备采购 意向汇总表 特别提示 微信机制调整，点击顶部"仪器信息网" → 右上方"…" → 设为 ★ 星标，否则很可能无法看到我 们的推送。 近日， z y c g r发布 2 2 项仪器设备采购意向，预算总额达 6 . 5 9 亿 元，涉及 X 射 线 衍 射 仪 、 X 射线光电能谱仪、拉曼光谱仪、辉光放电光谱仪、 1 2英寸快速退火炉 、1 2英寸真空退火炉、 近服役工况热考核测试系统 、高时空分辨率动态点火试验单元、氢燃烧宽频多维高动态光学测 试装置及溯源单元 等，预计采购时间为 2 0 2 5 年 11月 。 部分采购仪器简介： X射线光电能谱仪 X射线光电子能谱仪（X-ray Photoelectron Spectroscopy，XPS）是一种基于光电效应 原理的表面分析仪器，通过X射线激发样品表面原子发射光电子，分析其能量分布以获取表面 元素种类、化学态及相对含量等信息。 ...

Core Insights - The article discusses the successful completion of the "Semiconductor Material Testing Technology Forum" held on September 10, 2025, during the BCEIA 2025 event, featuring nine expert speakers who explored various aspects of semiconductor material testing and failure analysis [2][5]. Group 1: Forum Overview - The 21st Beijing Conference & Exhibition on Instrumental Analysis (BCEIA 2025) took place at the China International Exhibition Center, marking the 40th anniversary of BCEIA, with a theme focused on academic exchange and instrument exhibitions [3][34]. - The forum attracted over 300 industry professionals, both online and offline, highlighting the growing interest in semiconductor material testing [5]. Group 2: Key Presentations - Lin Miaoling from the Chinese Academy of Sciences presented on the characterization of in-plane anisotropic semiconductors using angle-resolved Raman spectroscopy, emphasizing the impact of sample thickness and substrate on Raman tensor properties [8]. - Xi Shanbin from the National Semiconductor Device Quality Inspection Center discussed the importance of semiconductor device testing and failure analysis, detailing various testing methods and their significance in product development and quality control [11]. - Ding Xin from HORIBA China showcased the application of optical spectroscopy technologies in semiconductor material characterization, highlighting the importance of high spectral resolution and sensitivity [14]. - Xu Wentao from Suzhou Laboratory discussed the development of testing capabilities for electronic chemicals, focusing on the application of domestic instruments in the semiconductor industry [17]. - Peng Jinlan from the University of Science and Technology of China presented on the development of in-situ silicon nitride thermoelectric chips for scanning electron microscopy, demonstrating their advantages over traditional sample stages [20]. - Hua Younan from Shengke Nano introduced a comprehensive failure analysis method for wafer-level quality control, advocating for the establishment of national standards to enhance quality management in semiconductor manufacturing [23]. - Li Chenhui from Beijing Xinlifang Technology Development Co., Ltd. analyzed the current state and trends of the semiconductor material testing industry from a big data perspective, emphasizing the rapid growth in demand for third-party testing services [26]. - Ma Hongtao from Beijing Software Product Quality Testing and Inspection Center discussed the common failure analysis equipment used in material research, highlighting the interdependence of failure analysis and material characterization [29]. - Ding Yang from the Chinese Academy of Sciences emphasized the critical role of Transmission Electron Microscopy (TEM) and Focused Ion Beam (FIB) technologies in analyzing semiconductor materials and devices, showcasing their applications in various fields [32].