Core Insights - The article discusses the successful completion of the "Semiconductor Material Testing Technology Forum" held on September 10, 2025, during the BCEIA 2025 event, featuring nine expert speakers who explored various aspects of semiconductor material testing and failure analysis [2][5]. Group 1: Forum Overview - The 21st Beijing Conference & Exhibition on Instrumental Analysis (BCEIA 2025) took place at the China International Exhibition Center, marking the 40th anniversary of BCEIA, with a theme focused on academic exchange and instrument exhibitions [3][34]. - The forum attracted over 300 industry professionals, both online and offline, highlighting the growing interest in semiconductor material testing [5]. Group 2: Key Presentations - Lin Miaoling from the Chinese Academy of Sciences presented on the characterization of in-plane anisotropic semiconductors using angle-resolved Raman spectroscopy, emphasizing the impact of sample thickness and substrate on Raman tensor properties [8]. - Xi Shanbin from the National Semiconductor Device Quality Inspection Center discussed the importance of semiconductor device testing and failure analysis, detailing various testing methods and their significance in product development and quality control [11]. - Ding Xin from HORIBA China showcased the application of optical spectroscopy technologies in semiconductor material characterization, highlighting the importance of high spectral resolution and sensitivity [14]. - Xu Wentao from Suzhou Laboratory discussed the development of testing capabilities for electronic chemicals, focusing on the application of domestic instruments in the semiconductor industry [17]. - Peng Jinlan from the University of Science and Technology of China presented on the development of in-situ silicon nitride thermoelectric chips for scanning electron microscopy, demonstrating their advantages over traditional sample stages [20]. - Hua Younan from Shengke Nano introduced a comprehensive failure analysis method for wafer-level quality control, advocating for the establishment of national standards to enhance quality management in semiconductor manufacturing [23]. - Li Chenhui from Beijing Xinlifang Technology Development Co., Ltd. analyzed the current state and trends of the semiconductor material testing industry from a big data perspective, emphasizing the rapid growth in demand for third-party testing services [26]. - Ma Hongtao from Beijing Software Product Quality Testing and Inspection Center discussed the common failure analysis equipment used in material research, highlighting the interdependence of failure analysis and material characterization [29]. - Ding Yang from the Chinese Academy of Sciences emphasized the critical role of Transmission Electron Microscopy (TEM) and Focused Ion Beam (FIB) technologies in analyzing semiconductor materials and devices, showcasing their applications in various fields [32].

Core Viewpoint - The "Semiconductor New Materials Industry Detection Innovation Development Forum" held in Shanghai highlighted the rapid growth and innovation in the semiconductor materials sector, emphasizing the importance of detection technology in ensuring material quality and performance [1][2]. Group 1: Market Insights - The global semiconductor market is projected to exceed $600 billion by 2024, with a record sales figure of $54.9 billion reported in February 2025 [7]. - Domestic companies such as Anji, Xinyang, and Nanda Optoelectronics have made significant technological breakthroughs in the materials field, showcasing the industry's innovative vitality [7]. - The domestic market for semiconductor materials is expected to account for over 40% by 2027, but there is a structural imbalance in the localization of wet electronic chemicals, with general products having over 50% localization while high-end functional products like photoresists and polishing liquids are below 15% [8]. Group 2: Detection Technology Challenges - The detection technology is crucial for semiconductor material R&D and production, as it ensures the control of material purity and crystal structure, which directly impacts chip yield [8]. - Current challenges in semiconductor material detection include the lack of standardized metrics, difficulties in handling hazardous materials, and insufficient application matching [10]. - The need for a standardized detection platform and collaborative efforts between academia and industry is emphasized to overcome technical bottlenecks [8][10]. Group 3: Innovations and Applications - The forum featured discussions on advanced detection methods such as electronic wet chemical detection and X-ray technology, which are essential for optimizing semiconductor processes [8][10]. - The establishment of a national new materials testing platform aims to support key material breakthroughs and domestic equipment validation, with over 8,000 samples tested to date [12]. - AI and big data analytics are being integrated into detection processes to enhance efficiency and reduce costs, with a focus on developing a collaborative ecosystem for semiconductor material detection [8][25]. Group 4: Future Directions - The roundtable discussions highlighted the importance of AI in semiconductor detection, emphasizing the need for AI models to be trained with specialized knowledge to avoid inaccuracies [25]. - The need for a three-tier mutual recognition system for electronic chemical detection was proposed to facilitate domestic product validation and standardization [26]. - The potential for Chinese standards to become international benchmarks through the integration of high-end instrument localization and AI technology was discussed [26].