通信及汽车零部件可钎焊压铸件
Search documents
美利信拟定增募资不超12亿元 用于半导体装备精密结构件等项目
Zheng Quan Shi Bao Wang· 2025-12-04 13:30
Core Viewpoint - Meilixin (301307) plans to raise no more than 1.2 billion yuan through a private placement of A-shares to fund semiconductor equipment precision structural components, communication and automotive parts die-casting industrialization projects, and to supplement working capital [1][2] Group 1: Business Strategy - The company has established a solid market position in aluminum alloy precision die-casting technology for automotive and communication equipment components [1] - To achieve sustainable development, the company has adopted a dual-driven strategy of "deepening core business + expanding emerging business," with a focus on cultivating the semiconductor business as a second growth curve [1] - The company has completed initial layout in the semiconductor field, mastering key manufacturing technologies for core components and establishing stable partnerships with some equipment manufacturers [1] Group 2: Capacity Expansion - The semiconductor equipment precision structural components project has a total investment of 555 million yuan, with 500 million yuan raised from the current funding round, aimed at addressing capacity bottlenecks and seizing domestic market opportunities [2] - The project will significantly enhance the production scale of semiconductor equipment precision structural components through the establishment of specialized production workshops and the introduction of advanced production and testing equipment [2] - The communication and automotive parts die-casting industrialization project has a total investment of 524 million yuan, with 500 million yuan raised, focusing on leasing production facilities and acquiring necessary production and testing equipment [2] Group 3: Financial Strategy - The company plans to allocate 200 million yuan from the raised funds to supplement working capital, alleviating financial pressure arising from business expansion [2]