格隆汇9月22日丨博威合金(601137.SH)在投资者互动平台表示，H公司一直是我们的重要合作伙伴之 一，在通讯基站，手机及笔记本电脑散热器，手机及通讯连接器等多个领域都有深度的合作。例如通讯 基站、手机及智能终端散热，高速背板连接器，电磁屏蔽材料，新一代半导体封装材料等等。随着H公 司对算力服务行业的赋能，将极大的拉动对材料的需求。 ...

Group 1 - The core viewpoint is that H Company is a significant partner for Bowei Alloy (601137.SH), collaborating in various fields such as communication base stations, mobile phone and laptop heat sinks, and communication connectors [1] - The collaboration includes deep partnerships in areas like communication base stations, mobile and smart terminal heat dissipation, high-speed backplane connectors, electromagnetic shielding materials, and next-generation semiconductor packaging materials [1] - The demand for materials is expected to increase significantly due to H Company's empowerment in the computing service industry [1]