证券日报网讯1月13日，华光新材在互动平台回答投资者提问时表示，公司的导电银浆、锡基钎料应用 于电子半导体产业，目前公司预成型高活性锡焊片及导电胶产品在半导体领域推进验证，还未实现批量 供应，请投资者注意投资风险。公司研发的锡基钎料已批量应用于PCBA制程，具体收入情况请关注公 司后续发布的定期报告。 ...

人民财讯1月13日电，华光新材(688379)1月13日在互动平台回复称，公司的导电银浆、锡基钎料应用于 电子半导体产业，目前公司预成型高活性锡焊片及导电胶产品在半导体领域推进验证，还未实现批量供 应。 ...

格隆汇1月13日丨华光新材(688379.SH)在投资者互动平台表示，公司的导电银浆、锡基钎料应用于电子 半导体产业，目前公司预成型高活性锡焊片及导电胶产品在半导体领域推进验证，还未实现批量供应， 请投资者注意投资风险。公司研发的锡基钎料已批量应用于PCBA制程，具体收入情况请关注公司后续 发布的定期报告。 ...

Core Insights - The company held its Q3 2025 earnings presentation on November 19, 2025, with full interaction from investors, achieving a 100% response rate to questions [1] Group 1: Project Updates - The Thailand project is currently in the equipment installation and trial production phase, with expected production start in early next year [2] - The company is actively pursuing a simplified procedure for a targeted issuance of new shares, with specific timelines to be announced in future announcements [3] Group 2: Financial Performance and Plans - The company is working on a share buyback plan, having already repurchased shares worth nearly 70 million yuan as of January 2025, with further plans to be disclosed as they develop [4] - The management reassured investors that the recent share reductions by executives are due to personal financial needs, not a lack of confidence in the company's future [5] Group 3: Business Development - The company reported continuous revenue growth in its data center-related business, particularly in the AI liquid cooling server sector, which is expected to contribute significantly to revenue as the AI industry expands [6][7] - The company is focusing on new product development and market expansion, with notable growth in the new energy vehicle and electronics sectors over the past two years [3][7] - The company is currently validating its pre-formed high-activity solder paste in the semiconductor field, but has not yet achieved mass supply [6][7] Group 4: Operational Metrics - The company's current capacity utilization rate exceeds 80% [6]

Core Viewpoint - The company is currently developing pre-formed high-activity tin solder sheets and conductive adhesive products for the semiconductor industry, but has not yet achieved mass supply [1] Group 1 - The company has products in the semiconductor field that are undergoing verification [1] - The company advises investors to be cautious regarding investment risks [1]