Group 1 - The article highlights the successful bulk delivery of Panel-level Glass Through Via (TGV) equipment by Dazhu Semiconductor to multiple clients, emphasizing the equipment's high stability and reliability, which supports immediate production and technological advancement [2][4]. - Dazhu Semiconductor's TGV equipment has overcome significant challenges in processing large glass substrates, improving product yield and paving the way for the mass production of the next generation of Chiplet packaging [4]. - The newly developed femtosecond laser-enhanced glass etching technology (FLEE) by Dazhu Semiconductor has increased processing area by 300% and reduced packaging costs by 40%, enhancing efficiency in mass production [4][6]. Group 2 - The FLEE-TGV equipment can process various hole types and sizes, with a maximum processing size of 730mm x 920mm, making it suitable for advanced packaging, display manufacturing, consumer electronics, and life sciences [6]. - The equipment features high precision with a through-hole diameter of ≤5μm and a depth-to-width ratio of ≥50:1, achieving international leading standards in quality and performance [4][6]. - The upcoming 2025 Heterogeneous Integration Annual Conference, organized by TrendBank, aims to focus on cutting-edge technologies in heterogeneous integration and advanced packaging, fostering collaboration between industry and academia [8].