Group 1 - Mitsui Mining & Smelting announced a price increase of approximately 15% for high-end electrolytic copper foil, confirming the supply tightness driven by AI server demand [1] - The demand for HVLP copper foil has surged, with usage per AI server being eight times that of traditional servers, driven by NVIDIA's new Rubin platform adopting HVLP 5th generation copper foil [1] - The price increase led by industry leaders indicates a sustained supply-demand gap in high-end copper foil (HVLP) due to capacity conversion and increasing demand, with expectations extending into mid-next year [1] Group 2 - Domestic copper foil manufacturers are making breakthroughs in the high-end PCB copper foil sector, with those possessing high-end capacity likely to benefit from increased volume and price [1] - Tongguan Copper Foil has established a complete product matrix covering HVLP generations 1-4, leading to significant profit improvements as high-end electronic circuit copper foil volumes increase [2] - Defu Technology has formed a dual-driven pattern with lithium battery and PCB copper foil, achieving global leadership through overseas acquisitions, with HVLP 4 copper foil already shipped for use in M9 materials [2]