1.4nm工艺

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曝三星1.4nm推迟至2028年!
国芯网· 2025-06-25 13:50
Core Viewpoint - Samsung has postponed the construction of its 1.4nm test line, originally scheduled for Q2 this year, with investments now expected to be delayed until the end of this year or early next year. This may push the mass production timeline for the 1.4nm process to around 2028 due to a sluggish market in the foundry business [1]. Group 1: Investment and Production Plans - Samsung's foundry division reported a loss of approximately 2 trillion KRW in Q1, leading to a reduction in its annual equipment investment plan from about 10 trillion KRW to around 5 trillion KRW [1]. - The company is shifting its focus to strengthening internal structures and concentrating resources on the 2nm process, which is expected to begin mass production by the end of this year [1]. - The Samsung System LSI division is planning to use the 2nm process for the upcoming "Exynos 2600" application processor, which is set to be released by the end of the year, potentially increasing the likelihood of successful mass production [1]. Group 2: Market Strategy - Samsung is actively seeking orders from major North American tech companies, including Tesla and Qualcomm, for its 2nm process [2]. - There are considerations to deploy the 2nm process at the newly constructed factory in Taylor, Texas, indicating a need to accelerate the development of this technology [3].
三星启动1nm工艺研发
国芯网· 2025-04-10 04:35
Core Viewpoint - Samsung Electronics is accelerating the development of 1nm wafer fabrication technology to create a competitive advantage, as it currently lags behind TSMC in the 2nm and 3nm processes [1][2]. Group 1: Samsung's Development Plans - Samsung has initiated the development of 1nm technology, selecting researchers from its 2nm projects to form a dedicated team [1]. - The company aims to mass-produce 1.4nm technology by 2027, with plans for 1nm production set for after 2029 [1]. - The development of 1nm technology requires new design concepts and the introduction of next-generation equipment, such as High-NA EUV lithography machines [1]. Group 2: Competitive Landscape - TSMC announced plans to start production of 1.6nm technology in the second half of 2026, bridging the gap between 1.4nm and 2nm processes [2]. - This move by TSMC is seen as a response to the rapidly changing demands of the AI semiconductor market [2].