Group 1: Company Overview - Guangli Technology Co., Ltd. is involved in semiconductor packaging and testing equipment and IoT safety monitoring equipment [1][2]. - The company has received widespread recognition for its domestic mechanical slicing equipment, which matches international standards in performance [2]. Group 2: Production Capacity and Orders - As of January 2026, the company has reached full production capacity for its domestic semiconductor slicing equipment, with continuous new orders being added since July 2025 [2][3]. - The second phase of the production project is expected to be fully operational by Q1 2027, with a projected capacity increase to over three times the current capacity upon completion [3]. Group 3: Customer Base and Market Demand - Approximately 50% of new orders in the semiconductor business come from major clients, primarily IDM and OSAT manufacturers [3]. - The company is dynamically adjusting its production capacity based on market demand changes [3]. Group 4: Product Development and Validation - The company is currently validating its new 12-inch high-precision cutting equipment, which is suitable for ultra-thin wafers and various advanced packaging applications [3]. - Several new products, including 12-inch laser cutting machines and grinding machines, are in the client validation phase, with positive feedback received [3]. Group 5: Future Plans - The company is evaluating the feasibility of implementing an equity incentive plan [3].