Core Viewpoint - Samsung Electronics has begun mass production of 12-layer HBME for NVIDIA, aiming to regain momentum in its HBM business despite ongoing quality tests with customers [1][2][3] Group 1: Production Strategy - Samsung started mass production of 12-layer HBME in February, with plans to supply improved products to NVIDIA by June or July [2][3] - The company has significantly increased its production capacity for 12-layer HBME, estimating a monthly output of 120,000 to 130,000 units [3] - Samsung's strategy to produce HBME 12-layer chips before receiving NVIDIA's supply approval is driven by the desire to capture market timing [2][3] Group 2: Market Demand and Risks - NVIDIA's demand for 12-layer HBME has surged since Q1 of this year, with plans to expand HBM usage based on the latest AI accelerator roadmap [2] - There is a risk that if NVIDIA's quality testing is delayed again, the pre-produced HBME 12-layer chips may become excess inventory [3] - Despite potential risks, Samsung is optimistic about the performance and stability of the 12-layer HBME, believing the worst-case scenario is unlikely [3] Group 3: Competitive Landscape - Even if supply to NVIDIA is hindered, Samsung can still supply the product to other major global tech companies, as demand for advanced HBM is rising among cloud service providers developing their own AI accelerators [4] - AMD has also shifted its orders from Samsung's 8-layer HBME to the improved 12-layer HBME this year, indicating a broader industry trend towards advanced memory solutions [5]