证券日报网讯 1月16日，晶盛机电在互动平台回答投资者提问时表示，在芯片制造和封装端，公司开发 了应用于芯片制造的8-12英寸减压外延设备、ALD设备等薄膜沉积类设备，应用于先进封装的12英寸减 薄抛光机、12英寸减薄抛光清洗一体机。以差异化的工艺和技术优势，为客户提供优质的产品和服务。 （文章来源：证券日报） ...

Core Viewpoint - Jing Sheng Mechanical & Electrical (300316) is focusing on advanced packaging solutions by developing specialized equipment to enhance product quality and service for its clients [1] Group 1: Company Developments - The company has developed a 12-inch thinning polishing machine for advanced packaging applications [1] - A 12-inch thinning polishing and cleaning integrated machine has also been introduced by the company [1] - The company is offering ultra-fast ultraviolet laser grooving equipment as part of its product lineup [1] Group 2: Competitive Advantage - The company emphasizes its differentiated processes and technological advantages to provide high-quality products and services to customers [1]