中微半导体设备（上海）股份有限公司 2025年度业绩快报公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大遗漏，并对其内容 的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 登录新浪财经APP 搜索【信披】查看更多考评等级 证券代码：688012 证券简称：中微公司 公告编号：2026-014 ● 中微半导体设备（上海）股份有限公司（以下简称"公司"）2025年营业收入约123.85亿元，较2024年 增加约33.19亿元，同比增长约36.62%。 ● 根据市场需求，公司加大研发力度，新产品数量快速增加。2025年全年公司研发投入约37.44亿元， 较2024年增长12.91亿元（增长约52.65%），研发投入占公司营业收入比例约为30.23%。 ● 公司预计2025年度实现归属于母公司所有者的净利润约为21.11亿元，与上年同期（法定披露数据） 相比，增加约4.96亿元，同比增加约30.69%。 ● 公司2025年度实现归属于母公司所有者的扣除非经常性损益的净利润约为15.50亿元，与上年同期 （法定披露数据）相比，增加约1.62亿元，同比增加约11.64%。 ● 公 ...

内容概况：在"后摩尔时代"，原子层沉积（ALD）技术凭借其独特的原子级精度和优异的三维保形性， 正从辅助工艺跃升为制造先进芯片三维结构的关键核心技术。2024年，中国ALD设备行业市场规模约 为45.22亿元，同比增长7.23%。一方面，集成电路制造正持续向更先进的节点突破，制造工艺步骤成倍 增加，直接拉动了对ALD设备的核心需求。另一方面，"超越摩尔"战略下的广阔应用正成为新的增长引 擎。高效太阳能电池（TOPCon）的产业化、OLED柔性显示的精密薄膜封装、锂电池固态电解质涂层 等新能源及新材料领域，正为ALD技术开辟远超传统半导体领域的巨大增量市场。 相关上市企业：微导纳米（688147）、拓荆科技（688072）、北方华创（002371）、中微公司 （688012） 相关企业：江苏南大光电材料股份有限公司、江苏雅克科技股份有限公司、华友钴业股份有限公司、赣 锋锂业股份有限公司、营口风光新材料股份有限公司、盈德气体集团有限公司、深圳市恒运昌真空技术 股份有限公司、中芯国际集成电路制造有限公司、隆基绿能科技股份有限公司、宁德时代新能源科技股 份有限公司、京东方科技集团股份有限公司、歌尔股份有限公司、迈瑞医 ...

Core Viewpoint - The semiconductor equipment industry is entering a high-growth cycle driven by AI computing demand, domestic substitution, and global capacity expansion, with significant performance improvements from both international and domestic companies [4][7][21]. Group 1: Industry Performance - ASML reported a net sales of €32.7 billion in 2025, a 16% year-on-year increase, with a backlog of €38.8 billion in unfulfilled orders [4]. - Samsung's semiconductor business saw a 33% increase in operating profit, while SK Hynix's Q4 operating profit surged by 137% year-on-year [4]. - Domestic semiconductor equipment companies like Jinhaitong and Changchuan Technology also announced significant performance increases [4]. Group 2: Demand Drivers - The scale application of generative AI has drastically reshaped storage demand, with AI server DRAM needs being eight times that of regular servers and NAND needs three times higher [6]. - High Bandwidth Memory (HBM) is emerging as a core growth engine, with a projected CAGR of 33% from 2024 to 2030, potentially capturing 50% of the DRAM market by 2030 [6]. - Major global storage manufacturers are ramping up production, with Samsung's capital expenditure for 2025 expected to increase by 89% and SK Hynix raising its annual capital expenditure to $20.3 billion [6]. Group 3: Domestic Substitution Progress - The domestic semiconductor equipment localization rate is expected to reach 35% in 2024, doubling from 16.4% in 2022, with etching equipment localization at 23% and CMP equipment at 30%-40% [7]. - China has maintained its position as the largest semiconductor equipment market globally for five consecutive years, with sales expected to reach $49.54 billion in 2024, accounting for 42.34% of the global market [7]. Group 4: Future Trends - The global DRAM industry capital expenditure is projected to reach $61.3 billion in 2026, a 14% year-on-year increase, while NAND Flash capital expenditure is expected to be $22.2 billion, up 5% [9]. - ASML's order situation reflects high industry prosperity, with €13.2 billion in new orders in 2025, including €7.4 billion for EUV lithography machines, and a backlog extending to 2027 [9]. - The global semiconductor equipment market is projected to reach $117 billion in 2024, with a CAGR of 8.4% from 2025 to 2033, potentially growing to $224.93 billion by 2033 [9]. Group 5: Key Segments - The etching equipment market, representing 22% of the front-end equipment market, is expected to reach a domestic market size of ¥48.67 billion in 2025 [12]. - Thin film deposition is also experiencing rapid growth, with a global market size of $12.68 billion, driven by domestic leaders like TuoJing Technology [12]. - Testing and packaging equipment are benefiting from advanced process promotion and capacity expansion, with companies like Changchuan Technology and Huafeng Measurement Control covering multiple semiconductor fields [12]. Group 6: Material and Component Localization - The localization rate of core semiconductor equipment components is expected to rise from 10% to 20% in 2024, with Anji Technology's CMP polishing liquid achieving a 15% global market share [14]. - Continuous breakthroughs in supporting segments are enhancing the competitiveness of domestic equipment, fostering a collaborative development advantage across the entire industry chain [14]. Group 7: Strategic Outlook for 2026 - The advanced process competition is intensifying, leading to a surge in demand for high-end equipment, with global semiconductor giants pushing for 2nm and below processes [17]. - Policy and capital are driving domestic substitution deeper into high-end segments, with significant support for key technologies and substantial financing events in the semiconductor equipment sector [18]. - The demand structure is optimizing, with emerging fields like AI computing centers and electric vehicles creating new growth opportunities, while domestic companies expand into overseas markets [19].

Core Insights - The semiconductor equipment industry is experiencing significant growth driven by AI computing power, domestic substitution, and global capacity expansion, marking a definitive growth cycle for the sector [1][14]. Group 1: Industry Performance - ASML reported a net sales of €32.7 billion in 2025, a 16% year-on-year increase, with a backlog of orders reaching €38.8 billion, of which €25.5 billion is from EUV [1]. - Samsung's semiconductor business saw an operating profit increase of 33%, while SK Hynix's Q4 operating profit surged by 137% [1]. - Domestic semiconductor equipment companies like Jinhaitong and Changchuan Technology also reported significant performance improvements [1]. Group 2: Demand Drivers - The scale application of generative AI has drastically reshaped storage demand, with AI servers requiring 8 times more DRAM and 3 times more NAND than regular servers, and each AI server needing up to 2TB of storage [2]. - HBM (High Bandwidth Memory) is emerging as a key growth driver, with a projected CAGR of 33% from 2024 to 2030, potentially capturing 50% of the DRAM market by 2030 [2]. - Major global storage manufacturers are ramping up production, with Samsung's capital expenditure for 2025 expected to increase by 89% and SK Hynix raising its capital expenditure to $20.3 billion [2]. Group 3: Domestic Market Dynamics - The domestic semiconductor equipment localization rate is projected to reach 35% in 2024, up from 16.4% in 2022, with etching equipment localization at 23% and CMP equipment at 30%-40% [3]. - China has maintained its position as the largest semiconductor equipment market globally for five consecutive years, with sales expected to reach $49.54 billion in 2024, accounting for 42.34% of the global market [3]. Group 4: Future Outlook - The global DRAM industry capital expenditure is forecasted to reach $61.3 billion in 2026, a 14% increase year-on-year, while NAND Flash capital expenditure is expected to be $22.2 billion, a 5% increase [5]. - ASML's order situation reflects high industry prosperity, with €13.2 billion in new orders in 2025, and a backlog extending to 2027, supporting future capacity releases [5]. - The global semiconductor equipment market is projected to reach $117 billion in 2024, with a CAGR of 8.4% from 2025 to 2033, potentially growing to $224.93 billion by 2033 [5]. Group 5: Key Trends - The competition in advanced processes is intensifying, with global semiconductor giants focusing on 2nm and below, driving demand for high-end semiconductor equipment [10][11]. - Policy and capital support are crucial for the advancement of domestic substitution, with significant investments in key technologies and local government subsidies for R&D [12]. - The demand structure is diversifying, with emerging fields like AI computing centers and electric vehicles driving growth, while domestic companies are expanding into overseas markets [13].

半导体行业布局顺利，紧抓大尺寸碳化硅材料历史机遇。1）半导体材料领域，公司完成12 英寸碳化硅 衬底关键技术突破，并建设加工中试线，加快推进碳化硅衬底片海外产能布局，抢抓第三代半导体材料 市场机遇；不断提高石英坩埚产品品质及服务能力，石英坩埚市场份额持续提升。 2）半导体精密零部件领域，公司加强核心零部件国产化的延伸布局，持续深化与产业链核心客户的合 作，不断提升产品供应与综合服务能力，紧抓半导体产业链国产化提速的行业趋势，公司半导体精密零 部件业务实现产业规模快速提升，市场竞争力持续增强。3）半导体设备端，公司开发了应用于芯片制 造的8-12 英寸减压外延设备、ALD 设备等薄膜沉积类设备，应用于先进封装的12 英寸减薄抛光机、12 英寸减薄抛光清洗一体机、超快紫外激光开槽设备。以差异化的工艺和技术优势，为客户提供优质的产 品和服务，有望跟随客户放量。 盈利预测：预计公司25-27 年实现营业收入110.79/109.42/119.27 亿元，归母净利润10.50/17.77/20.31 亿 元。公司深耕光伏设备，单晶炉龙头地位明确，紧抓大尺寸碳化硅材料历史机遇，首次覆盖，给予"推 荐"评级。 风险提示:下 ...

证券日报网讯2月4日，微导纳米在互动平台回答投资者提问时表示，公司作为高效光伏电池技术与设备 的领军者之一，客户覆盖一线主流电池片厂商。为满足下游光伏技术迭代需求，公司一直持续开展前瞻 性技术布局，对各类新兴应用领域进行技术储备。目前，公司已具备异质结(HJT)、柔性钙钛矿及P型 TOPCon等电池关键设备的供应能力，覆盖核心工艺环节。尤其在钙钛矿电池领域，公司是国内少数实 现ALD、磁控溅射、蒸镀等核心真空工艺设备全覆盖的供应商之一。公司自主研发的ALD设备是制备 高性能柔性钙钛矿电池的关键装备，在同类产品中市场占有率领先，已多次助力客户刷新钙钛矿组件效 率纪录。柔性钙钛矿电池在部分需求超轻量化、高性能、可柔性卷展的电池应用场景中展现出良好的市 场潜力。目前，相关产品处于市场推广初期，当前订单和收入占比还十分小。未来公司将持续深耕技术 研发，为客户提供更全面的解决方案，以满足于客户各类新兴应用领域的需求。 ...

格隆汇2月4日丨微导纳米(688147.SH)在投资者互动平台表示，公司作为高效光伏电池技术与设备的领 军者之一，客户覆盖一线主流电池片厂商。为满足下游光伏技术迭代需求，公司一直持续开展前瞻性技 术布局，对各类新兴应用领域进行技术储备。目前，公司已具备异质结（HJT）、柔性钙钛矿及P型 TOPCon等电池关键设备的供应能力，覆盖核心工艺环节。尤其在钙钛矿电池领域，公司是国内少数实 现ALD、磁控溅射、蒸镀等核心真空工艺设备全覆盖的供应商之一。公司自主研发的ALD设备是制备 高性能柔性钙钛矿电池的关键装备，在同类产品中市场占有率领先，已多次助力客户刷新钙钛矿组件效 率纪录。柔性钙钛矿电池在部分需求超轻量化、高性能、可柔性卷展的电池应用场景中展现出良好的市 场潜力。目前，相关产品处于市场推广初期，当前订单和收入占比还十分小。未来公司将持续深耕技术 研发，为客户提供更全面的解决方案，以满足于客户各类新兴应用领域的需求。 ...

证券日报网讯 1月29日，微导纳米在互动平台回答投资者提问时表示，在ALD设备中，水蒸气与臭氧均 可作为氧源。公司出厂的设备能够为客户提供多种配置选择，实际运行中客户会根据成本、稳定性、工 艺控制等因素决定具体采用的工艺路线。 ...

Core Viewpoint - The company anticipates that its platform products, including vertical furnace tubes, Track, and PECVD equipment, will contribute significantly to overall revenue starting in 2026, marking them as key growth drivers for the future [1] Group 1: Product Development and Market Launch - The company plans to launch its first self-developed high-output (300WPH) KrF process front-end coating and developing (Track) equipment, UltraLITHKrF, in Q3 2025, which has already been successfully delivered to a leading logic wafer factory in China [1] - The UltraLITHKrF product features high capacity, advanced temperature control technology, and real-time process control and monitoring capabilities, expanding the applications related to photolithography [1] Group 2: PECVD Equipment and R&D Investment - The company expresses strong confidence in the differentiated technological framework and future market prospects of PECVD equipment, with plans to increase R&D investment to expand its market presence domestically and internationally [1] - Continuous technological advancements are being made in LPCVD and ALD furnace series equipment, achieving innovative breakthroughs [1] Group 3: Innovations in Vertical Furnace and ALD Equipment - The company's self-developed UltraFn vertical furnace equipment features a unique vertical structure design with a processing capability of up to 1250°C, focusing on high-end IGBT applications, receiving positive market feedback [1] - Future product goals include achieving a processing capability of 1350°C, which is expected to be a significant benefit for IGBT applications [1] - The company has been strengthening its R&D investment in ALD equipment, accumulating a series of self-developed patented technologies with global intellectual property protection, aiming for further contributions in uniformity and material aspects [1]

（文章来源：证券日报） 证券日报网讯 1月27日，晶盛机电在互动平台回答投资者提问时表示，在芯片制造端，公司开发了应用 于芯片制造的8英寸-12英寸减压外延设备、ALD设备等薄膜沉积类设备。其中12英寸减压外延设备广泛 适用于逻辑芯片、存储芯片、硅光芯片、功率器件中的各项制程；常压外延设备适用于功率器件； ALD设备适用于逻辑芯片、存储芯片中的各项制程。 ...