Core Insights - Zhaochi Co., Ltd. held an on-site investor meeting with 26 institutions and 33 participants, discussing the company's development history, industry advantages, and future plans [1] - The company is focusing on vertical integration in the optical communication sector, with plans to advance self-supply of optical communication chips [2][3] Group 1: Company Overview - Zhaochi Co., Ltd. has a 20-year development history and is actively pursuing advancements in LED chips and optical communication laser chips [1] - The company is transitioning towards high-tech fields such as Mini/Micro LED displays, optical communication, and compound semiconductors [3] Group 2: Product Development and Technology - The company is implementing a "wide and slow" architecture for Micro LED optical interconnects, utilizing multi-core imaging fibers for high-density signal transmission [2] - The 2.5G DFB laser chip has completed initial testing and is expected to achieve mass production by 2025, with further developments in 10G, 25G, and 50G chips planned [2] Group 3: Market Expansion - Zhaochi Co., Ltd. is expanding its overseas market presence, particularly in North America, driven by demand from content internet companies like Amazon [2] - The company is enhancing its production capacity in Vietnam, increasing annual output from 2 million units to 11 million units [3] Group 4: Financial Performance - The company experienced a slight decline in revenue and net profit in the first half of 2025, primarily due to international trade tariffs affecting smart terminal shipments [3] - Despite challenges, revenue from the LED industry chain, optical communication chain, and internet video business showed steady growth [3]

Core Viewpoint - The company has established a vertically integrated layout in the optical communication field, focusing on the supply of optical chips through a stepwise approach [1] Group 1: Company Developments - The company plans to leverage its vertical integration advantages to promote the independent supply of optical communication chips [1] - The 2.5G DFB laser chip has begun wafer production, with mass production expected by 2025 [1] - Development work for 10G and 25G DFB laser chips has started, with plans to launch 50G DFB and CW DFB chips by 2026 [1] Group 2: Research and Development - The company is actively engaged in the research and development of silicon photonics and PIC technology [1] - The goal is to create solutions for co-packaged optics (CPO) architecture, providing core support for 800G/1.6T ultra-high-speed interconnections [1]

证券代码：002429 证券简称：兆驰股份 深圳市兆驰股份有限公司 投资者关系活动记录表 编号：2025-003 投资者关系 活动类别 □ 特定对象调研 □ 分析师会议 □ 媒体采访 □ 业绩说明会 □ 新闻发布会 □ 路演活动 □现场参观 ■ 其他 （现场调研） 参与单位名 称及人员 姓名 26 家机构 33 人次（详见附件《与会清单》） 时间 2025 年 9 月 16 日 13:30-15:00 地点 南昌 上市公司 接待人员 姓名 兆驰股份副总经理兼董事会秘书单华锦女士，兆驰半导体 CTO 胡加辉 先生，兆驰瑞谷总经理黄建辉先生，兆驰瑞谷副总经理殷瑞麟先生等。 投资者关系 活动主要内 容介绍 一、介绍环节 兆驰股份副总经理兼董事会秘书单华锦女士就公司 20 年发展历 程、产业优势及未来发展规划；兆驰瑞谷副总经理殷瑞麟先生就公司光 通信器件、模块业务进展，技术及发展规划；兆驰半导体 CTO 胡加辉 先生就公司 LED 芯片业务、光通信激光芯片业务进展，技术方案规划 以及公司 Micro LED 光连接方案分别做了简单介绍。 二、互动交流环节 （一）在使用 Micro LED 进行光互连时，是否仍然需要光 ...