Group 1 - The company plans to apply for registration and issuance of short-term financing bonds not exceeding RMB 2 billion [1] - The company successfully issued its fourth phase of short-term financing bonds for the year 2025, with an actual issuance amount of RMB 300 million [1] - The issuance interest rate for the bonds is set at 1.55% [1] Group 2 - The company is not classified as a dishonest entity according to checks conducted through the "Credit China" website [2]

Group 1 - The company, Inspur Electronic Information Industry Co., Ltd., has announced the issuance of its fourth phase of ultra-short-term financing bonds for the year 2025, with a total registered amount of 5 billion yuan [1] - The bonds were approved by the board on April 11, 2023, and subsequently by the shareholders' meeting on May 12, 2023, with the registration valid for two years from the date of the notice [1] - The specific issuance details include an amount of 1 billion yuan, a face value of 100 yuan per bond, and an interest rate of 1.68%, with the funds expected to be fully received by May 21, 2025 [1] Group 2 - The lead underwriter for this issuance is China Construction Bank, with Industrial Bank serving as the co-lead underwriter [1] - The announcement regarding the issuance was disclosed through various financial news outlets and the company's official website [1]