Core Viewpoint - Japan's Rapidus plans to build a next-generation 1.4 nm wafer fab by FY2027, aiming for production in 2029, to compete with industry giants like TSMC and Intel [2][4]. Group 1: Company Overview - Rapidus was established in 2022 and is supported by eight major Japanese corporations, including DENSO, Kioxia, Mitsubishi UFJ Financial Group, NEC, NTT, SoftBank, Sony, and Toyota [4]. Group 2: Competitive Landscape - Rapidus aims to close the gap with TSMC, which announced its 1.4 nm technology earlier this year and will fully launch R&D next year [4]. - Intel has already begun production of its 18A node process (2 nm level), indicating a highly competitive environment for Rapidus [4]. - TSMC is experiencing a surge in orders due to the "AI boom," with its Arizona facility ramping up production of the latest process chips [4]. Group 3: Production Challenges - Rapidus is expected to start mass production of 2 nm process wafers in the second half of 2027, but faces potential yield issues common in mature foundries before mass production [4].