Core Insights - Broadcom Inc. is expanding its AI infrastructure portfolio to support gigawatt-scale AI clusters, showcasing solutions at the 2026 Optical Fiber Communications Conference [1][2] - The company emphasizes the need for an open, scalable, and power-efficient infrastructure to meet the demands of generative AI, aiming for a roadmap to 200T connectivity [2][3] Product Innovations - Introduction of the 3.5D XPU, 102.4T Ethernet switch with co-packaged optics, and 400G/lane optical DSP, which are designed to enhance performance and efficiency in AI applications [1][4] - Launch of Taurus™, the first 400G/lane optical DSP, which, along with 400G electro-absorption modulated laser and photodiodes, enables cost-effective 1.6T transceivers [2][4] Industry Collaboration - Broadcom is part of the Optical Compute Interconnect Multi-Source Agreement to establish open specifications for a multi-vendor ecosystem in AI infrastructure [3][4] - The company is collaborating with over 30 partners to demonstrate its solutions at OFC 2026, focusing on advancements in optical networking [5] Technical Advancements - The 3.5D XDSiP platform combines 2.5D techniques and 3D-IC integration for enhanced compute performance and power efficiency [4] - Broadcom's Ethernet portfolio includes the only shipping 102.4T Tomahawk 6 switch, designed for large-scale AI networks [4] Conference Engagement - Broadcom will participate in various technical sessions at OFC 2026, discussing challenges and advancements in optical networking and AI infrastructure [5]