Core Viewpoint - The company has developed three types of copper powder products for heat dissipation applications, addressing high thermal demand scenarios in various technologies [2] Group 1: Product Types - The first type is a new heat dissipation copper powder designed for high thermal demand applications, specifically for GPU and NPU, and is the first of its kind in the industry, currently used in Huawei's Ascend 910B chip [2] - The second type is copper powder for MIM applications, used in the production of pin-fin heat dissipation substrates, with over 3,000 tons supplied externally for IGBT heat sinks [2] - The third type is 3D printing copper powder, which is currently in the verification and promotion stage, not yet in mass supply, primarily for new liquid cooling heat exchangers and specialized conductive components [2]

Group 1 - The trend of liquid cooling in servers is becoming more prominent, and there is interest in the application of 3D printed copper powder materials for this purpose [2] - The company, Youyan Powder Materials (688456.SH), has confirmed that its 3D printed copper powder is already being used by clients to develop liquid cooling copper plates and other heat dissipation components, with related applications currently in progress [2]