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3D SiP与内埋技术等先进封装
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中富电路(300814.SZ):在3D SiP与内埋技术等先进封装方向,已配合多家海内外客户完成研发打样工作
Ge Long Hui· 2025-12-23 13:25
Group 1 - The company, Zhongfu Circuit (300814.SZ), has announced its involvement in AI data center power supply solutions, including primary, secondary, and tertiary power systems [1] - The company is advancing in 3D SiP and embedded technology, having collaborated with multiple domestic and international clients to complete research and development sampling [1]
中富电路:在3D SiP与内埋技术等先进封装方向已完成研发打样工作
Mei Ri Jing Ji Xin Wen· 2025-12-23 13:13
每经AI快讯,12月23日,中富电路(300814)在互动平台表示,公司在AI数据中心一次、二次、三次 电源有布局,公司在3D SiP与内埋技术等先进封装方向,已配合多家海内外客户完成研发打样工作。 ...