Workflow
55nmBCD集成DrMOS芯片
icon
Search documents
芯联集成前三季度营收同比增近两成 预计全年营收为80亿元至83亿元
Zheng Quan Ri Bao Wang· 2025-10-27 13:44
Core Viewpoint - ChipLink Integrated Circuit Manufacturing Co., Ltd. reported strong financial performance in Q3 2025, with revenue of 1.927 billion yuan, a year-on-year increase of 15.52%, and a total revenue of 5.422 billion yuan for the first three quarters, reflecting a 19.23% growth [1] Financial Performance - The company expects to achieve an annual revenue of 8 to 8.3 billion yuan in 2025, representing a growth of 23% to 28% compared to the previous year [1] - The gross profit margin for the third quarter was 3.97%, marking five consecutive quarters of positive gross profit growth [1] Product Development and Market Expansion - ChipLink has made significant progress in the "New Energy + AI" sectors, with its self-developed 8-inch SiCMOSFET devices sent to AI companies in Europe and the U.S. [1] - The company has entered mass production of data transmission chips for AI servers and data centers, and launched a second-generation high-efficiency power management chip platform [2] - The company’s first 55nm BCD integrated DrMOS chip has passed customer validation, and the 180nm DrMOS has entered mass production [1][2] Industry Applications - In the robotics sector, ChipLink has achieved mass production of various components, including VCSELs and pressure sensors, and has secured contracts for its miniaturized drive modules [2] - The company is focusing on the 800V high-voltage direct current (HVDC) market to enhance the efficiency of end-to-end power systems for data centers [2] Sector-Specific Growth - In the new energy vehicle sector, revenue grew by 18% in the first three quarters, with over 1 million vehicles equipped with SiCMOSFETs [3] - The industrial control sector saw revenue growth exceeding 26%, driven by advancements in high-voltage and high-power solutions [3] - In the high-end consumer market, the company achieved significant market share with its IMU and high-performance microphones [3]
芯联集成:应用于AI服务器和AI加速卡的电源管理芯片已实现大规模量产
Xin Lang Cai Jing· 2025-08-15 07:58
Core Insights - Company has made significant progress in AI server and data center sectors, including mass production of data transmission chips and power management chips for AI servers and AI accelerator cards [1] Group 1: Product Development - Data transmission chips have entered mass production [1] - Power management chips for AI servers and AI accelerator cards have achieved large-scale production [1] - The first 55nm BCD integrated DrMOS chip in China has passed customer verification [1] Group 2: Customer Engagement - The company has launched a second-generation high-efficiency power management chip manufacturing platform specifically for data centers [1] - Key customers have been introduced to the new manufacturing platform [1]