Group 1: Investor Relations Activities - The company conducted an investor relations activity on January 23, 2026, with 53 institutional investors participating [1] - Activities included a company tour, production workshop visit, and a presentation on the company's development [1][2] Group 2: Company Performance and Strategy - The company aims to embrace AI and enhance its technological leadership in the global PCB manufacturing sector [1][3] - High-end products have significantly increased in proportion, driving rapid growth in company performance [3] Group 3: Production Capacity and Expansion - The company maintains a good order backlog and production capacity utilization, with ongoing expansion efforts [3][4] - Domestic production facilities in Huizhou are gradually being put into operation, while overseas facilities in Thailand and Vietnam are progressing as planned [3][4] Group 4: Product Development and Market Position - The company has achieved mass production capabilities for high-precision circuit boards and is advancing in the development of next-generation AI server products [3][4] - The company is actively involved in the research and development of new technologies and materials, collaborating closely with major clients [4] Group 5: Raw Material Supply and Pricing - The company has established stable relationships with key raw material suppliers, ensuring a steady supply [4] - Strategies are in place to mitigate the impact of raw material price fluctuations on product pricing [4] Group 6: Hong Kong Listing Progress - The company is in the process of issuing H shares and has submitted the application to the Hong Kong Stock Exchange [5] - The listing is subject to approval from regulatory authorities and market conditions, with ongoing updates to be provided [5]