Group 1 - Samsung Electronics is considering a strategic investment in Intel to strengthen its foundry business and compete against TSMC in advanced chip manufacturing [2] - Intel holds a significant advantage in advanced packaging technology, particularly with its 18A process utilizing hybrid bonding, which is crucial for higher density and efficient chip designs [2] - Samsung's chairman has been actively seeking partnerships in the U.S., indicating that collaboration with Intel could accelerate Samsung's ambitions in the packaging sector [2] Group 2 - The situation has become more complex following the announcement of the U.S. government acquiring nearly 10% of Intel, making it the largest shareholder and raising concerns about potential favoritism towards Intel [3] - Analysts suggest that Samsung may face challenges in securing U.S. customers for its Texas factory due to the U.S. government's support for Intel, potentially leading to lost orders [3] - Both Samsung and Intel are racing to advance their next-generation process nodes, with Samsung preparing to launch a 2nm process while Intel is advancing its 18A process [3] Group 3 - Samsung has recently regained interest from Qualcomm and signed a long-term supply agreement with Tesla for AI5 semiconductors until 2033 [3] - The establishment of multiple alliances among major players is becoming a norm in the industry, and even a slight reduction in TSMC's lead could attract more global customers to Samsung and Intel [3] - Lower foundry prices are expected to benefit end consumers by reducing costs in final products [4]