Core Viewpoint - The global AI and HPC chip competition has officially entered the 2nm era, with TSMC initiating a "preparation mode" for advanced process technology [2] Group 1: 2nm Process Development - TSMC's 2nm (N2) process represents a significant shift from FinFET to GAAFET architecture, with strong demand from clients exceeding expectations [2] - Major clients for the 2nm process include Apple and Qualcomm, with general-purpose GPUs and ASICs expected to ramp up production starting next year [2][3] - TSMC's N2 family is projected to have a larger scale and longer lifecycle than the 3nm process, with mass production expected to ramp up in 2026 [3] Group 2: Advanced Packaging Technologies - TSMC is simultaneously upgrading its advanced packaging systems to meet the demands of AI chips, which are moving towards multi-chiplet and large package sizes [3] - The company is expected to increase its CoWoS monthly capacity by over 70% this year, while also validating next-generation technologies like CoWoP and CPO [3] - The ability to produce high-yield large system-level packages is critical for the semiconductor ecosystem's resilience [3]