Group 1 - The surge in equipment computing power demand is driving the need for effective heat dissipation solutions, with traditional passive cooling methods like graphene and VC expected to transition towards active cooling solutions [1] - The micro-pump liquid cooling solution is gaining traction, with a clear trend and strong certainty of implementation, particularly in mobile devices [2] - The liquid cooling driving chip technology presents a significant barrier, with limited competition from foreign analog manufacturers, creating a favorable competitive landscape for domestic companies [3] Group 2 - AI advancements, particularly from companies like Apple, are expected to lead to the release of various flagship AI smartphones, further increasing heat dissipation demands [1] - Huawei's introduction of a "micro-pump liquid cooling phone case" in 2023 demonstrates the potential for this technology, which includes a high-performance phase change material to efficiently absorb heat [2] - Domestic companies Aiwei Electronics and Nanchip Technology are strategically positioned to benefit from the active cooling wave, having developed advanced liquid cooling driving chips that enhance cooling efficiency and reduce power consumption [3]