Group 1 - The surge in equipment computing power demand is driving the need for effective heat dissipation solutions, with traditional passive cooling methods like graphene and VC expected to transition towards active cooling solutions [1] - The micro-pump liquid cooling solution is gaining traction, with a clear trend and strong implementation certainty, particularly in the context of AI innovations led by companies like Apple [2] - The liquid cooling driving chip technology presents a significant barrier, with limited competition from foreign analog manufacturers, creating a favorable competitive landscape for domestic companies [3] Group 2 - Aiwey Electronics has launched a new domestic liquid cooling driver, the AW86320 piezoelectric driver, capable of providing over 180Vpp, significantly enhancing cooling efficiency in small electronic devices [3] - Nanchip Technology has developed the SC3601 piezoelectric micro-pump liquid cooling driver chip, achieving a tenfold improvement in energy efficiency and low standby power consumption, filling a gap in domestic technology [3] - The micro-pump liquid cooling trend is expected to expand from mobile phone cases to high-end smartphones by Q4 2025, with 2026 anticipated to be a breakout year for active cooling solutions [2]

Group 1 - The surge in equipment computing power demand is driving the need for effective heat dissipation solutions, with traditional passive cooling methods like graphene and VC expected to transition towards active cooling solutions [1] - The micro-pump liquid cooling solution is gaining traction, with a clear trend and strong certainty of implementation, particularly in mobile devices [2] - The liquid cooling driving chip technology presents a significant barrier, with limited competition from foreign analog manufacturers, creating a favorable competitive landscape for domestic companies [3] Group 2 - AI advancements, particularly from companies like Apple, are expected to lead to the release of various flagship AI smartphones, further increasing heat dissipation demands [1] - Huawei's introduction of a "micro-pump liquid cooling phone case" in 2023 demonstrates the potential for this technology, which includes a high-performance phase change material to efficiently absorb heat [2] - Domestic companies Aiwei Electronics and Nanchip Technology are strategically positioned to benefit from the active cooling wave, having developed advanced liquid cooling driving chips that enhance cooling efficiency and reduce power consumption [3]

Investment Rating - The industry investment rating is "Accumulate" (Maintain) [1] Core Insights - The report highlights opportunities in AI-driven cooling solutions, particularly focusing on micro-pump liquid cooling technologies from companies like Aiwei and Nanchip, which are expected to significantly enhance thermal management in electronic devices [2][7] - The introduction of Aiwei's AW86320 piezoelectric driver and Nanchip's SC3601 micro-pump liquid cooling chip is set to revolutionize cooling efficiency, with the latter achieving a tenfold improvement in energy savings and a standby power consumption as low as microampere levels [2][7] - The report anticipates a shift from passive to active cooling solutions, driven by the increasing computational demands of AI applications, with liquid cooling solutions expected to triple thermal efficiency compared to traditional methods [7] Summary by Sections Industry Trends - The report notes a clear trend towards micro-pump liquid cooling solutions, with expectations for these technologies to be implemented in high-end mobile devices by Q4 2025, marking a significant milestone for the industry [7] - The report emphasizes that the technology barrier for micro-pump liquid cooling lies in the driving chips, with domestic companies like Aiwei and Nanchip positioned to benefit from this emerging trend due to limited competition from foreign manufacturers [7]

Core Insights - OPPO has introduced an active cooling system with a built-in fan in its mid-range products, while Huawei and other manufacturers are also testing similar technologies [1] - Huawei's Mate80 series may feature a dual cooling solution with an active fan and micro-pump liquid cooling, although its implementation remains uncertain [1] - Liquid cooling technology is still in the early stages of development, with many related products in research or validation phases, but there is optimism about its future potential in consumer electronics, AI devices, and high-power chips [1] Company Developments - Aiwei Electronics has completed verification tests for its ultra-low power high-voltage piezoelectric micro-pump liquid cooling product, aiming for mass production by Q4 2025 [2][3] - The company anticipates potential orders from clients by the end of the year, although specific client names cannot be disclosed due to confidentiality agreements [3] - Aiwei's product pricing is estimated at approximately $2-3 per unit for small batches and $1-1.5 per unit for large batches, with expected annual revenue from this product being less than 100 million RMB based on a hypothetical shipment of 10 million phones [3] Industry Trends - The liquid cooling technology is expected to expand beyond consumer electronics into industrial and automotive sectors [1] - Companies like Nanchip Technology and Zhihua Technology are also developing liquid cooling solutions, with a focus on low-power applications in mobile devices [3][4] - The industry is seeing significant investment in liquid cooling technology, with many firms recognizing it as a key strategic direction for future growth [6]

Group 1 - Huawei is set to launch the Mate80 series with significant upgrades in design, performance, and imaging systems, marking a true iteration of the series [1] - The performance enhancement includes a "dual-track parallel" cooling solution that combines active fans and micro-pump liquid cooling, breaking through the technical boundaries of flagship device cooling and waterproofing [1] - The demand for efficient cooling solutions is increasing due to the rising power consumption of key components like chips, motherboards, and batteries, driven by advancements in AI technology [1] Group 2 - The micro-pump liquid cooling technology, which was introduced during the Mate60 period, utilizes high-performance phase change materials (PCM) to efficiently absorb and distribute heat [1] - The transition from passive to active cooling solutions is expected as mobile terminals face thermal load challenges, with micro-pump liquid cooling poised to revolutionize the cooling landscape in various product categories [1] - According to broker estimates, the market potential for active liquid cooling in mobile phones and laptops alone could exceed 100 billion [1] Group 3 - Nanxin Technology has launched the SC3601 piezoelectric micro-pump liquid cooling driver chip, which has been validated by multiple clients and is set for mass production [2] - Feirongda has introduced cooling devices and module products, including micro-pump liquid cooling modules, to meet customer demands [3]