Core Insights - The article discusses the iterative upgrades of Ascend chips and the expansion of supernode clusters, highlighting the acceleration of domestic computing power in China [1][3]. Group 1: Ascend Chip Iteration - Ascend chips are expected to maintain an annual iteration rate from 2026 to 2028, with the release of Ascend 950PR in Q1 2026, Ascend 950DT in Q4 2026, Ascend 960 in Q4 2027, and Ascend 970 in Q4 2027 [2]. - The Ascend 950 series will support new data formats such as FP8, MXFP8, HiF8, and MXFP4, while the 960 and 970 series will introduce HiF4 format [2]. Group 2: Supernode Products - Huawei has launched multiple supernode products, including Atlas 900 A3, which has been deployed over 300 times across various industries, and Atlas 950 SuperPoD and Atlas 960 SuperPoD, which can support clusters exceeding 500,000 and 1,000,000 cards, respectively [3]. - The network architecture of these supernodes supports hybrid topologies and allows for linear expansion from 64 cards to 8192 cards [3]. Group 3: Market Catalysts - Domestic semiconductor equipment has achieved technological breakthroughs, and domestic supernodes are expanding into training scenarios, indicating a positive trend for the industry [4].