Group 1 - The stock price of Siquan New Materials (301489.SZ) fell by 16.98% to 203.3 yuan, with a trading volume of nearly 3 billion yuan for the day [1] - Jinfu Technology announced that it has received an order from a Taiwanese customer for a custom-developed 0.08mm blade heat dissipation structure, which has been used in the liquid cooling system for the B200 chip [1] - The adaptation plan for the next-generation B300 chip has completed multiple rounds of sample testing with positive feedback and is now entering the production preparation stage [1] Group 2 - Industry insiders suggest that the market performance is partly reflecting the perception that Siquan New Materials' business is being "snatched" [1]

Group 1 - The development and application demand for AI technology is driving the continuous increase in market requirements for GPU performance, leading to accelerated iterations and upgrades of GPU chips [1] - Current GPU products are evolving from the B200 to the new generation B300, both based on the Blackwell architecture; GB200 and GB300 represent the core development direction of data center computing power [1] Group 2 - The significant increase in chip power and computing performance has made heat dissipation a key bottleneck in performance release [2] - Jinfu Technology has developed a 0.08mm serrated heat dissipation architecture, which has received orders from a Taiwanese customer for use in the liquid cooling system of the B200 chip, utilizing the latest MLCP technology to effectively address TDP thermal effects for processors with power consumption of 1800W-2000W and above [2] - Jinfu Technology is deepening technical cooperation with leading global GPU companies and their ODM partners, aiming to complete reliability verification before large-scale shipments of GB300 and enhance R&D investment in microchannel cooling plate architecture [2]