Group 1 - The development and application demand for AI technology is driving the continuous increase in market requirements for GPU performance, leading to accelerated iterations and upgrades of GPU chips [1] - Current GPU products are evolving from the B200 to the new generation B300, both based on the Blackwell architecture; GB200 and GB300 represent the core development direction of data center computing power [1] Group 2 - The significant increase in chip power and computing performance has made heat dissipation a key bottleneck in performance release [2] - Jinfu Technology has developed a 0.08mm serrated heat dissipation architecture, which has received orders from a Taiwanese customer for use in the liquid cooling system of the B200 chip, utilizing the latest MLCP technology to effectively address TDP thermal effects for processors with power consumption of 1800W-2000W and above [2] - Jinfu Technology is deepening technical cooperation with leading global GPU companies and their ODM partners, aiming to complete reliability verification before large-scale shipments of GB300 and enhance R&D investment in microchannel cooling plate architecture [2]