Core Insights - Company has received an order for a custom-developed 0.08mm blade cooling structure from a Taiwanese client, which is now used in the liquid cooling system for the B200 chip [1] - The new cooling structure utilizes the latest MLCP technology, providing a significant competitive edge and effectively addressing the TDP thermal issues for processors with power consumption of 1800W to 2000W and above [1] - The company has completed multiple rounds of sample testing for the next-generation B300 chip adaptation plan, receiving positive feedback and is now entering the production preparation phase [1] Industry Trends - The demand for GPU performance is increasing due to the rapid development and application of AI technology, leading to the evolution of GPU products from B200 to the new B300 generation, both based on the Blackwell architecture [1] - The GB200 and GB300 represent the core development direction for data center computing power, with significant increases in chip power and performance making thermal management a critical bottleneck [1] Financial Performance - For the first three quarters of 2025, the company reported a revenue of 1.594 billion yuan, reflecting a year-on-year growth of 27.78% [2] - The revenue for the third quarter also stood at 1.594 billion yuan, maintaining the same year-on-year growth rate of 27.78% [2] Future Plans - The company aims to deepen technical collaboration with leading global GPU companies and their ODM partners, ensuring reliable verification of the liquid cooling plate production process before the large-scale shipment of GB300 [2] - There will be increased investment in the research and development of microchannel cooling plate architecture and manufacturing processes to achieve breakthroughs in cooling efficiency for higher power consumption chips [2]

Market Overview - The market experienced slight declines with mixed performance across indices, yet the overall profit-making effect was not strong [3] - The Shanghai Composite Index, Shenzhen Component Index, and ChiNext Index fell by 0.22%, 0.44%, and 0.15% respectively, with nearly 3,000 stocks declining and over 2,300 rising [3] - The total trading volume in the two markets remained at 1.1 trillion [3] Fujian Local Stocks - Fujian local stocks surged significantly following a series of articles from Xinhua News Agency, with notable performances from Pingtan Development and Dahua Intelligent, both achieving four consecutive trading limit increases [7] - The sector saw an overall increase of over 6% by the end of the trading day, marking a true breakout after continuous testing [7] - Other stocks such as Xiamen Port and Xiamen Airport also reached their daily limits, indicating strong investor interest [7] Abstract Stocks - Abstract stocks began to gain momentum in the afternoon, with Unification Holdings leading the charge and achieving a rapid increase [9] - Guotong Holdings attempted to reach its limit but ultimately closed up by 5.48% due to less favorable name recognition compared to peers [9] - Other stocks like Huasheng Technology also saw significant gains, reflecting a trend of speculative trading based on company names [9] Jinfu Technology - Jinfu Technology announced a significant order for a custom-developed cooling architecture for a Taiwanese client, which contributed to its stock price surge [11] - The company is preparing for production related to the next-generation B300 chip, aligning well with market expectations [11] - Despite a history of annual losses, the stock's performance indicates strong speculative interest driven by recent announcements [11] Huajian Group - Huajian Group faced a dramatic decline, with a cumulative drop of over 40% in the last five trading days, attributed to a lack of clarity regarding its future plans [14] - The stock's previous surge of over 200% was linked to speculation about a potential asset restructuring, which was later denied by the company [14] - The recent sell-off has attracted attention from retail investors looking to capitalize on perceived undervaluation despite the stock's volatility [14]

Market Overview - On October 28, A-shares experienced volatility with the Shanghai Composite Index briefly surpassing 4000 points, marking a new high since August 2015, but ultimately closed down by 0.22% [4][8] - The total trading volume in the Shanghai and Shenzhen markets was 2.15 trillion yuan, a decrease of 192.3 billion yuan from the previous trading day [4] Human-Robot Sector - The human-robot concept stocks surged, with Jinfu Technology hitting a 20% limit up, driven by a new order from a Taiwanese client for a custom-developed cooling architecture for the B200 chip [3][4] - Other stocks in the sector, such as Yongmaotai and Fangzheng Electric, also saw significant gains, contributing to a strong performance in the human-robot sector [4] Fujian Province Developments - Fujian's stock market saw a rally, with several stocks hitting the limit up, including Pingtan Development and Luqiao Information, following the signing of 172 projects worth over 200 billion yuan at the 2025 World Marine Equipment Conference [5][6] - The province is focusing on seven key areas for industrial planning, including new information technology and high-end equipment, aiming to build a competitive strategic emerging industry cluster [6] Future Market Outlook - Analysts remain optimistic about the Chinese stock market, citing a "transformation bull" trend driven by economic transition, declining risk-free returns, and capital market reforms [8] - The market is expected to continue its upward trajectory, with a focus on sectors that may achieve sustained high profit growth, particularly in manufacturing and AI technology [9] - Foreign investment interest in Chinese stocks is increasing, with projections indicating a potential 30% rise in major indices by the end of 2027, supported by a 12% growth in earnings [9]

超级赛道突然异动！ 展望A股后市，有分析人士指出，继续看多中国股市，中国"转型牛"内在趋势确定：经济转型加快、无风险收 益下沉与资本市场改革。 人形机器人板块突然爆发 10月28日早盘，A股市场震荡拉升，沪指一度站上4000点大关，创2015年8月19日以来新高。午后，市场风云 突变，三大指数悉数转跌，截至收盘，沪指跌0.22%，深成指跌0.44%，创业板指跌0.15%。沪深两市成交额 2.15万亿元，较上一个交易日缩量1923亿元。 盘面上，人形机器人概念股异动拉升，锦富技术直线封板，录得20%涨停，永茂泰、方正电机亦强势涨停，超 捷股份、楚江新材、南京聚隆、三花智控、阿尔特等涨幅居前。 据锦富技术官微消息，锦富技术定制开发的0.08毫米铲齿散热架构已获得某台湾客户的订单，已用于B200芯片 的液冷散热系统。据该客户反馈，此架构采用业界最新MLCP(微通道液冷板)技术，具备显著的先发优势与技 术先进性，可有效解决1800W—2000W及以上功耗处理器的TDP热效应问题，保障处理器模组低温稳定运行。 此外，针对下一代B300芯片的适配方案也已完成多轮送样测试，反馈良好，进入生产准备阶段。 10月28日，A股三 ...

格隆汇10月28日｜思泉新材(301489.SZ)今日股价收跌16.98%报203.3元，全天成交额放大至近30亿元。 同行业的锦富技术官微消息显示，锦富技术定制开发的0.08毫米铲齿散热架构已获得某台湾客户的订 单，已用于B200芯片的液冷散热系统。此外，针对下一代B300芯片的适配方案也已完成多轮送样测 试，反馈良好，进入生产准备阶段。有业内人士称，市场的表现一定程度上是在反应思泉新材"业务被 抢"。 ...

Group 1 - The development and application demand for AI technology is driving the continuous increase in market requirements for GPU performance, leading to accelerated iterations and upgrades of GPU chips [1] - Current GPU products are evolving from the B200 to the new generation B300, both based on the Blackwell architecture; GB200 and GB300 represent the core development direction of data center computing power [1] Group 2 - The significant increase in chip power and computing performance has made heat dissipation a key bottleneck in performance release [2] - Jinfu Technology has developed a 0.08mm serrated heat dissipation architecture, which has received orders from a Taiwanese customer for use in the liquid cooling system of the B200 chip, utilizing the latest MLCP technology to effectively address TDP thermal effects for processors with power consumption of 1800W-2000W and above [2] - Jinfu Technology is deepening technical cooperation with leading global GPU companies and their ODM partners, aiming to complete reliability verification before large-scale shipments of GB300 and enhance R&D investment in microchannel cooling plate architecture [2]

人民财讯10月28日电，据锦富技术（300128）官微消息，锦富技术定制开发的0.08毫米铲齿散热架构已 获得某台湾客户的订单，已用于B200芯片的液冷散热系统。据该客户反馈，此架构采用业界最新 MLCP(微通道液冷板)技术，具备显著的先发优势与技术先进性，可有效解决1800W—2000W及以上功 耗处理器的TDP热效应问题，保障处理器模组低温稳定运行。此外，针对下一代B300芯片的适配方案 也已完成多轮送样测试，反馈良好，进入生产准备阶段。 ...

Core Viewpoint - Jinfu Technology has secured an order for a custom-developed liquid cooling plate architecture, which will be used in the cooling system for NVIDIA's B200 chip, showcasing its technological advancement and market competitiveness [1] Group 1: Product Development - The custom-developed cooling architecture features a thickness of 0.08 millimeters and utilizes the latest MLCP (Microchannel Liquid Cooling Plate) technology, providing a significant first-mover advantage [1] - The cooling solution effectively addresses the TDP thermal effects of processors with power consumption ranging from 1800W to 2000W and above, ensuring stable low-temperature operation of the processor module [1] Group 2: Client Feedback and Future Plans - Feedback from the Taiwanese client indicates that the new cooling architecture has performed well, leading to the completion of multiple rounds of sample testing for the next-generation B300 chip adaptation [1] - The company is now entering the production preparation phase for the B300 chip cooling solution, indicating a positive outlook for future orders and product development [1]