人民财讯11月26日电，奕东电子（301123）11月26日公告，公司拟使用6120万元，用于对深圳冠鼎进行 投资，最终取得深圳冠鼎51%股权。子公司东莞市可俐星电子有限公司（以下简称"可俐星"）增资 222.22万元，由深圳冠鼎的原实际控制人或其指定的第三方出资3000万元认购。深圳冠鼎在液冷散热领 域深耕多年，拥有AI算力液冷散热产品结构综合解决方案能力。 ...

Core Viewpoint - The company, ChaoPinSan (300647), emphasizes its focus on the research and application of cooling technology, highlighting its proprietary technology system that enhances product performance [1] Group 1: Technology and Innovation - The company has developed a comprehensive set of proprietary technologies related to its main business products, including pressure fastening, fin locking, seamless tight fitting, diffusion welding, and tooth embedding technology [1] - These core technologies significantly improve the cooling performance of the company's products [1] Group 2: Future Strategy - The company plans to leverage its existing proprietary technology advantages and core patents to continuously enhance product cooling performance [1] - There is a commitment to strengthen technological research and product iteration to improve the company's core competitiveness [1]

Core Insights - The liquid cooling technology is gaining prominence in the digital economy era, driven by the "dual carbon" strategy and the national project "East Data West Computing" [1][2] - The capital market has responded positively, with the liquid cooling sector index rising by 2.22% and a total transaction volume of 58.358 billion yuan on November 13 [1] Industry Overview - Data centers, while being the engine of the digital economy, are also significant energy consumers, facing pressure to transform under the "dual carbon" strategy [2] - By 2025, data centers are required to improve energy efficiency by 30%, with a target Power Usage Effectiveness (PUE) of below 1.3, marking a critical threshold for operational viability [2] Technology and Market Dynamics - Traditional air cooling methods are inadequate for meeting the new efficiency standards, necessitating revolutionary cooling solutions like liquid cooling [2] - Liquid cooling technology can potentially reduce overall energy consumption in data centers by over 30%, with its cooling efficiency being significantly higher than that of air cooling [2] Competitive Landscape - The liquid cooling market is expanding rapidly, with companies like Zhongshi Technology and Wanma Technology increasing their investments in liquid cooling solutions [3] - The liquid cooling technology is evolving towards more efficient and intelligent systems, with two main types: cold plate liquid cooling and immersion liquid cooling, each with distinct advantages and cost implications [3] Future Trends - The immersion liquid cooling technology is expected to become mainstream as costs decrease, and it will likely integrate with AI and IoT for smarter thermal management [3]

Core Insights - The company is focusing on server liquid cooling as an important expansion direction for its new business [1] - Since the beginning of the year, the company has been increasing resource investment in product research and development, customer development, and capacity construction in the liquid cooling field [1] - Currently, the customer introduction, product certification, and mass production supply work for liquid cooling modules and core materials are accelerating [1]

Group 1 - The stock price of Siquan New Materials (301489.SZ) fell by 16.98% to 203.3 yuan, with a trading volume of nearly 3 billion yuan for the day [1] - Jinfu Technology announced that it has received an order from a Taiwanese customer for a custom-developed 0.08mm blade heat dissipation structure, which has been used in the liquid cooling system for the B200 chip [1] - The adaptation plan for the next-generation B300 chip has completed multiple rounds of sample testing with positive feedback and is now entering the production preparation stage [1] Group 2 - Industry insiders suggest that the market performance is partly reflecting the perception that Siquan New Materials' business is being "snatched" [1]

Group 1 - The development and application demand for AI technology is driving the continuous increase in market requirements for GPU performance, leading to accelerated iterations and upgrades of GPU chips [1] - Current GPU products are evolving from the B200 to the new generation B300, both based on the Blackwell architecture; GB200 and GB300 represent the core development direction of data center computing power [1] Group 2 - The significant increase in chip power and computing performance has made heat dissipation a key bottleneck in performance release [2] - Jinfu Technology has developed a 0.08mm serrated heat dissipation architecture, which has received orders from a Taiwanese customer for use in the liquid cooling system of the B200 chip, utilizing the latest MLCP technology to effectively address TDP thermal effects for processors with power consumption of 1800W-2000W and above [2] - Jinfu Technology is deepening technical cooperation with leading global GPU companies and their ODM partners, aiming to complete reliability verification before large-scale shipments of GB300 and enhance R&D investment in microchannel cooling plate architecture [2]

Core Insights - Shenzhen Cheng Tian Wei Ye Technology Co., Ltd. has established a joint venture, SuperX Cooltech, with SuperX AI Technology Limited to focus on AI server and high-performance computing liquid cooling systems [1][2] - The partnership signifies a strategic move in Cheng Tian Wei Ye's global strategy for digital and energy thermal management [1][2] Group 1: Liquid Cooling Technology and Market Position - Liquid cooling technology is becoming essential for AI data centers due to the limitations of traditional air cooling methods, especially with the rise of high-power GPUs [2] - The joint venture aims to provide efficient and reliable liquid cooling solutions for the global market, excluding mainland China and Hong Kong [1][2] - Cheng Tian Wei Ye is leveraging its expertise in semiconductor materials and thermal management to create a comprehensive liquid cooling product line [2][5] Group 2: Core Product System of the Joint Venture - The joint venture will develop a core product system that includes high-strength nano-injection liquid cooling plates, microchannel liquid cooling plates (MLCP), liquid cooling modules, and CDU systems [3][4] - The MLCP is designed for high-density cooling solutions, supporting precise temperature control and thermal load balancing [3][4] - The integrated solutions aim to achieve system-level energy efficiency with a PUE of less than 1.1 [3] Group 3: Key Technological Innovations - The joint venture will utilize advanced technologies such as nano-injection molding, material reduction techniques, fluid optimization designs, and intelligent control systems [4] - These innovations are expected to provide a competitive edge in the liquid cooling market [4] Group 4: Global Market Outlook - The global liquid cooling systems market is projected to grow significantly, driven by increasing power density and efficiency demands in data centers [5] - The MLCP technology is anticipated to enter mass production by mid-2026, with strong interest from major AI chip customers [5] - The joint venture's product offerings are positioned to cover the entire thermal management chain from chip to cabinet, enhancing its market potential [5]

Core Insights - The article discusses the increasing demand for AI computing power and the challenges in thermal management, particularly the introduction of microchannel liquid cooling plate (MLCP) technology as a potential solution [2][57]. Group 1: MLCP Technology Overview - MLCP technology integrates a metal cover and liquid cooling plate with a microchannel design, enhancing cooling efficiency and reducing system size [4][6]. - The cost of MLCP is projected to be 3 to 5 times higher than existing cooling solutions, with manufacturing costs for GPUs potentially increasing by 5 to 7 times if MLCP is widely adopted [2][4]. Group 2: Thermal Management Challenges - The thermal power of the Rubin GPU is expected to rise from 1.8 kW to 2.3 kW, necessitating the introduction of MLCP technology by late 2026 [7][9]. - Current cooling solutions may not suffice for the increasing power demands of AI chips, indicating a critical need for advanced thermal management technologies [2][9]. Group 3: Industry Developments - Boyd, a leading supplier, has delivered 5 million liquid cooling plates to large-scale data centers, highlighting the growing importance of liquid cooling technology in AI computing [10]. - The article emphasizes that MLCP technology is gaining traction in the industry, with ongoing research and development efforts to address its challenges [6][57]. Group 4: Future Outlook - The article concludes that MLCP technology represents a significant advancement in thermal management for high-power AI platforms, despite facing production and technical validation challenges [57][59]. - The upcoming Thermal Management Industry Conference will focus on the latest developments in MLCP and liquid cooling technologies, providing a platform for industry experts to discuss solutions to the growing thermal challenges in AI computing [59].