Core Insights - Bumping technology is a critical foundational process in advanced packaging types such as FC, 2.5D/3D, and WLP, extending from the front-end wafer manufacturing stage [1] - According to TrendBank, the demand for advanced packaging wafers in mainland China has reached 19 million pieces annually, accounting for 40% of the market share (equivalent to 12-inch wafers) [1] - The Yangtze River Delta region, which includes Shanghai, Anhui, Jiangsu, and Zhejiang, leads the nation with 51% of the advanced wafer bump manufacturing capacity [1] Company Insights - In the FC Bump segment, Qizhong Technology ranks first in China, focusing on specialty packaging for display chip flip-chip packaging [1] - For WLP Bump, Shenghe Jingwei holds the top position domestically, operating in a general comprehensive packaging sector that targets consumer electronics, telecommunications, and data center applications [1] - In the 2.5D/3D Bump category, Shenghe Jingwei also leads the market in China [1]