Core Viewpoint - The article discusses the upcoming 2025 Heterogeneous Integration Annual Conference organized by TrendBank and the Yongjiang Laboratory, focusing on advanced packaging technologies in the semiconductor industry, particularly heterogeneous integration and multi-material integration [14][18]. Conference Overview - The conference will take place from November 17-19, 2025, at the Nanyuan Wanghai Hotel in Zhenhai District, Ningbo, with an expected attendance of 300-500 participants [18]. - The event aims to gather industry and academic experts to discuss cutting-edge technologies in heterogeneous integration and advanced packaging [16]. Key Topics and Presentations - COMSOL's China Technical Manager, Zhong Zhenhong, will present on "The Application of COMSOL Multiphysics® in Advanced Packaging of Semiconductors" [2]. - The conference will cover various topics including 2.5D/3D heterogeneous integration, optical-electrical co-packaging, and wafer-level bonding technologies [16][14]. Industry Context - Heterogeneous integration is becoming a crucial direction in the semiconductor field, especially as traditional Moore's Law approaches physical limits [14]. - The conference aims to address the challenges and opportunities presented by new semiconductor technologies driven by applications in artificial intelligence, smart driving, and high-performance computing [14]. Supporting Organizations - The conference is supported by the Ningbo Electronic Industry Association and other local organizations, highlighting the collaborative effort to enhance the semiconductor industry in the Ningbo and Yangtze River Delta regions [14][18]. Registration and Fees - Registration fees are set at RMB 2500 per person, with early bird discounts available [19].