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从铜到CPO:人工智能互连变了
半导体行业观察· 2026-02-01 02:25
Core Insights - The transition to optical interconnects in AI systems is driven by bandwidth demands and the limitations of electrical SerDes, impacting system power budgets and physical architecture [2][4][11] Group 1: Scalability and Connectivity - Vertical scaling aims to maximize performance within tightly coupled systems, focusing on low latency and high synchronization while aggregating more compute, memory, and bandwidth [3] - Horizontal scaling distributes workloads across multiple servers to enhance overall system throughput, making optical interconnects essential for communication over longer distances [3][4] - High-speed copper interconnects dominate in short-distance, tightly coupled environments, while Ethernet and InfiniBand form the backbone of large-scale AI clusters [3][4] Group 2: Challenges of Electrical Interconnects - Despite advancements in SerDes technology, system-level limitations are increasing, with electrical channels becoming bottlenecks as data rates rise [5] - The need for enhanced equalization and digital signal processing to maintain signal integrity over long distances leads to increased power consumption and thermal load [5][6] Group 3: Role of Co-Packaged Optics (CPO) - CPO is reshaping system design by placing optical engines closer to switch ASICs, reducing I/O power and improving signal integrity without relying on complex electrical channels [7][11] - The deployment of optical links is seen as crucial for network architecture expansion, with companies like Marvell and Broadcom favoring optical solutions over copper in large-scale deployments [9][10] Group 4: Future of Interconnects - The distinction between vertical and horizontal scaling may blur as the number of accelerators per logical node increases, leading to potential optical I/O use in vertical scaling scenarios [10] - The evolution of AI system architecture is pragmatic, with copper remaining dominant in low-latency, short-distance scenarios, while optical devices expand in areas where power, distance, and density constraints conflict [11]